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Conference

Study of electromigration mechanisms in 22nm half-pitch Cu interconnects by 1/f noise measurements

Subjects: 1/f noise; copper; electromigration

  • Source: ISBN:9781509064731 ; ISSN:2380-6338 ; 2017 IEEE International Interconnect Technology Conference (IITC), (1-3) ; 2017 IEEE International Interconnect Technology Conference (IITC), Hsinchu, Taiwan,

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