نتائج البحث

Greening the bottom line.

• Authors : Kos, Sayre

Subjects: *Flexible packaging; *Energy consumption; *Solvents & the environment

• Source: Flexible Packaging. Mar2009, Vol. 11 Issue 3, p16-21. 6p. 3 Color Photographs.

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ROUNDTABLE ON ADHESIVES.

• Authors : Lin Lin¹; Hunt, Todd²

Subjects: *Adhesive manufacturing; *Physiological effects of solvents; *Polymerization -- Methodology

• Source: Flexible Packaging. Jun2017, Vol. 20 Issue 5, p32-33. 2p. 2 Color Photographs.

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Advanced BIOREMEDIATION Substrates.

• Authors : Wilson, Scott B.

Subjects: *Bioremediation; *Biodegradation; *Environmental remediation

• Source: Pollution Engineering. Oct2007, Vol. 39 Issue 10, p41-48. 7p.

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Edible Oils.

• Authors : Borden, Bob

Subjects: *Biodegradation; *Solvents; Edible fats & oils

• Source: Pollution Engineering. Oct2002, Vol. 34 Issue 10, p16. 4p. 2 Color Photographs, 1 Diagram, 5 Graphs.

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Remove Oils and Solvents without Slowing the Flow.

• Authors : Aymong, Greg G.¹ ; Abbott, Kirk W.²

• Source: Pollution Engineering. May2004, Vol. 36 Issue 5, p16-20. 5p. 1 Color Photograph, 1 Diagram.

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Inside the BLACK BOX.

• Authors : Baldwin, Brett ; Ogles, Dora ; Davis, Greg

Subjects: *Bioremediation; *Biological nutrient removal; *Biological treatment of water

• Source: Pollution Engineering. Aug2008, Vol. 40 Issue 8, p43-45. 3p.

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Epoxy resurfacer.

Subjects: *Epoxy coatings; *Pavement overlays; *Pavement skid resistance

• Source: Food Engineering. Feb2006, Vol. 78 Issue 2, p33-33. 1/5p. 1 Color Photograph.

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GROUNDWATER AND SOLVENTS.

Subjects: *Groundwater pollution; *Organic solvents; *PollutantsFloridaLockheed Martin Energy Systems Inc.

• Source: Pollution Engineering. Jun2005, Vol. 37 Issue 6, p8-8. 1/4p.

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Army tests enviro-friendly solvent alternative.

• Authors : Mouche, Carol

Subjects: *Organic solvents; LactatesIllinois; Argonne (Ill.); United StatesUnited States. Army ; Argonne National Laboratory

• Source: Pollution Engineering. Sep99, Vol. 31 Issue 9, p35. 1p.

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New heat pump recovers solvents.

• Source: Engineered Systems. Aug96, Vol. 13 Issue 8, p14. 1/5p.

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