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  • 1-10 ل  2,004 نتائج ل ""Copper""

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Academic Journal

SYNTHESIS OF COPPER METAL/SALTS FROM COPPER BLEED SOLUTION OF A COPPER PLANT.

  • Source: Mineral Processing & Extractive Metallurgy Review. Apr2006, Vol. 27 Issue 2, p159-175. 17p. 2 Diagrams, 6 Charts, 3 Graphs.

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Academic Journal

Production of nanoparticles of copper compounds by anodic dissolution of copper in organic solvents.

  • Source: Journal of Applied Electrochemistry. Dec2006, Vol. 36 Issue 12, p1407-1414. 8p. 4 Black and White Photographs, 9 Charts, 8 Graphs.

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Academic Journal

Anodically grown films on copper and copper–nickel alloys in slightly alkaline solutions.

  • Source: Journal of Applied Electrochemistry. May2006, Vol. 36 Issue 5, p583-590. 8p. 1 Diagram, 2 Charts, 9 Graphs.

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Academic Journal

Amperometric determination of thiourea in alkaline media on a copper oxide–copper electrode.

  • Source: Journal of Applied Electrochemistry. Oct2006, Vol. 36 Issue 10, p1075-1081. 7p. 2 Black and White Photographs, 1 Chart, 8 Graphs.

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Academic Journal

Effect of nickel on copper anode passivation in a copper sulfate solution by electrochemical impedance spectroscopy.

  • Source: Journal of Applied Electrochemistry. Jun2006, Vol. 36 Issue 6, p691-701. 11p. 3 Black and White Photographs, 2 Diagrams, 5 Charts, 7 Graphs.

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Academic Journal

Copper absorption during hypokinesia in copper supplemented and unsupplemented rats.

  • Source: Trace Elements & Electrolytes. 2006 1st Quarter, Vol. 23 Issue 1, p21-28. 8p.

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Academic Journal

Processing of copper dust for tolerable iron containing electrolyte.

  • Source: Transactions - Institution of Mining & Metallurgy. Section C. Mineral Processing & Extractive Metallurgy. Dec2006, Vol. 115 Issue 4, p234-240. 7p. 1 Diagram, 2 Charts, 4 Graphs.

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Academic Journal

Application of environmentally friendly ligands for alkaline electroless copper plating systems: electroless copper deposition using trisodium salt of 2-hydroxy-1,2,3-propanetricarboxylic acid as Cu(II) ligand.

  • Source: Chemija. 2006, Vol. 17 Issue 4, p20-29. 10p.

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Academic Journal

Effect of Cu(II) ligands on electroless copper deposition rate in formaldehyde solutions: An EQCM study.

  • Source: Journal of Applied Electrochemistry. Nov2006, Vol. 36 Issue 11, p1261-1269. 9p. 2 Charts, 8 Graphs.

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Academic Journal

Involvement of a metastable surface state in the electrocatalytic, electrodeposition and bath additive behaviour of copper in acid solution.

  • Source: Journal of Applied Electrochemistry. Aug2006, Vol. 36 Issue 8, p919-929. 11p. 1 Diagram, 13 Graphs.

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  • 1-10 ل  2,004 نتائج ل ""Copper""