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Wafer Bumping Solder Paste Selection.

• Authors : Byle, Fritz

• Source: Advanced Packaging. Feb2004, Vol. 13 Issue 2, p39-41. 3p.

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UB Materials Engineer Invents New Thermal Paste.

• Source: Advanced Packaging. Oct2003, Vol. 12 Issue 10, p16. 1/7p.

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High-density Wafer Bumping with Solder Paste.

• Authors : Lathrop, Richard

• Source: Advanced Packaging. May2005, Vol. 14 Issue 5, p12-17. 5p.

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Wafer Bumping.

• Authors : Buchanan, Ellery

• Source: Advanced Packaging. Feb2004, Vol. 13 Issue 2, p43-44. 2p.

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Global Trends in Lead-free Soldering.

• Authors : Lau, John H.; Liu, Katrina

• Source: Advanced Packaging. Feb2004, Vol. 13 Issue 2, p25-28. 4p.

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LTCC Integration of Passives.

• Authors : Liang Chai, Katrina; Shaikh, Aziz; Stygar, Vern

• Source: Advanced Packaging. Feb2004, Vol. 13 Issue 2, p31-32. 2p.

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Innovations in IC Packaging Adhesives.

• Authors : Kropp, Michael¹; Behr, Andrew¹

• Source: Advanced Packaging. Aug2005, Vol. 14 Issue 8, p16-30. 6p.

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Cleaning with Aqueous TMAH.

• Authors : Sachdev, Krishna

• Source: Advanced Packaging. Apr2007, Vol. 16 Issue 3, p28-38. 4p.

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Mass Imaging Responds to Wafer-Scale Packaging Advances.

• Authors : Heimsch, Richard

• Source: Advanced Packaging. May2005, Vol. 14 Issue 5, p20-23. 4p.

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2004 ADVANCED PACKAGING AWARDS.

• Source: Advanced Packaging. Sep2004, Vol. 13 Issue 9, p65-68. 4p.

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