Light curable (meth)acrylate resin composition for thermoplastic elastomers bonding

12024,574

17/444616

August 06, 2021

The present invention provides a light curable (meth)acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth)acrylate resin composition of the present invention comprises: a (meth)acrylic monomer, a polyolefin (meth)acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25° C., and a photoinitiator. The present invention also provides a cured product of the light curable (meth)acrylate resin composition and a use of the composition.

Henkel AG & Co. KGaA (Duesseldorf, DE)

Henkel AG & Co. KGaA (Duesseldorf, DE)

1. A light curable (meth)acrylate resin composition comprising, (a) a (meth)acrylic monomer selected from the group consisting of isobornyl (meth)acrylate, 3,3,5-trimethylcyclohexyl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, octadecyl (meth)acrylate, isodecyl acrylate, trimethyl cyclohexyl acrylate, and combinations thereof, (b) an acryloyl-group-terminated polyisobutylene having a viscosity of 200 000 to 2 500 000 mPa*s, (c) a photoinitiator selected from the group consisting of alpha-hydroxy ketones, phosphine oxides and combinations thereof, and (d) 2,5-thiophenediyl bis(5-tert-butyl-1,3-benzoxazole, wherein the composition comprises no polyurethane (meth)acrylate monomer.

2. A light curable (meth)acrylate resin composition, comprising (a) a (meth)acrylic monomer, (b) an acryloyl-group-terminated polyisobutylene having a viscosity of 200 000 to 2 500 000 mPa*s, and (c) a photoinitiator, wherein the content of the component (a) is from 50 wt % to 90 wt %, based on the total weight of the light curable (meth)acrylate resin composition, and the content of component (b) is from 10 wt % to 40 wt %, based on the total weight of the light curable (meth)acrylate resin composition.

3. The light curable (meth)acrylate resin composition according to claim 2 , wherein the weight ratio of component (a) to component (b) is in the range of from 6:1 to 1:1.

4. The light curable (meth)acrylate resin composition according to claim 2 , wherein the content of the component (c) is from 1% to 15% by weight, based on the total weight of the light curable (meth)acrylate resin composition.

5. The light curable (meth)acrylate resin composition according to claim 2 , further comprising an additive selected from the group consisting of a fluorescent additive, a filler, a pigment/dye, an adhesion promotor and combinations thereof.

6. The light curable (meth)acrylate resin composition according to claim 1 , wherein the composition is an adhesive, sealant or coating.

7. A cured product of the light curable (meth)acrylate resin composition of claim 1 .

8. A method for producing the cured product of claim 7 , comprising the following steps: (i) providing the light curable (meth)acrylate resin composition, and (ii) exposing the light curable (meth)acrylate resin composition to light to obtain the cured product thereof.

9. A method of adhering components together, said method comprising: (i) mating a first component having a light curable (meth)acrylate resin composition according to claim 1 applied thereto with a second component; and (ii) curing the composition between the components to be adhered together.

10. A light curable (meth)acrylate resin composition according to claim 1 for thermoplastic elastomers bonding of a medical device.

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