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Effect of Grain Structure of Gold Plating Layer on Environmental Reliability of Sintered Ag-Au Joints

• Authors : Youshuo Ma; Xin Li; Hongyu Zhang

Subjects: sintered silver joint; gold plating layer; reliability

• Source: Materials, Vol 17, Iss 8, p 1844 (2024)

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High-Pressure-Assisted Large-Area (>2400 mm2) Sintered-Silver Substrate Bonding for SiC Power Module Packaging

• Authors : Jiafeng Xue; Xin Li

Subjects: sintered silver; high pressure assisted; large area

• Source: Materials, Vol 17, Iss 8, p 1911 (2024)

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Thermomechanical Modeling of Sintered Silver - A Fracture Mechanics-based Approach: Extended Abstract: Preprint

• Authors : Narumanchi, Sreekant [National Renewable Energy Laboratory (NREL), Golden, CO (United States)] (ORCID:0000000153376069)

• Source: Conference: Presented at the13th International Conference and Exhibition on Device Packaging, 6-9 March 2017, Fountain Hills, Arizona

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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

• Authors : Paret, Paul [National Renewable Energy Laboratory (NREL), Golden, CO (United States)]

• Source: Conference: Presented at the Vehicle Technologies Annual Merit Review and Peer Evaluation Meeting, 5-9 June 2017, Washington, D.C.

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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

• Authors : DeVoto, Douglas

• Source: Conference: Presented at the Vehicle Technologies Office (VTO) Annual Merit Review and Peer Evaluation, 6-10 June 2016, Washington, D.C.

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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging; NREL (National Renewable Energy Laboratory)

• Authors : DeVoto, Douglas

• Source: Conference: Vehicle Technologies Office (VTO) Annual Merit Review and Peer Evaluation, 8-12 June 2015, Washington, D.C

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Investigation on thermal conductivity of silver-based porous materials by finite difference method

• Authors : Xiong, Ziming; Wang, Xuhui; He, Mu ...

Subjects: Equivalent thermal conductivity; Finite difference method; Porous media

• Source: ISSN: 2352-4928 ; Materials Today Communications ; https://hal.science/hal-03888871 ; Materials Today Communications, 2022, 33, ⟨10.1016/j.mtcomm.2022.104897⟩.

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Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages

• Authors : Lederer, Martin; Gökdeniz, Zeynep Gökce; Khatibi Damavandi, Golta ...

Subjects: creep; finite element analysis; sintered silver

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Performance and Reliability of Bonded Interfaces for High-Temperature Packaging (Presentation)

• Authors : Devoto, D.

• Source: Conference: Presented at the FY15 APEEM Kickoff Meeting, 18-20 November 2014, Oak Ridge National Laboratory, Oak Ridge, Tennessee; Other Information: NREL (National Renewable Energy Laboratory)

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Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

• Authors : Wereszczak, A.

• Source: 2014; HITEC; Conference: Presented at IMAPS/HiTEC, 13-15 May 2014, Albuquerque, New Mexico

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