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Lead-Free Solder: Interconnect Reliability

• Authors : Shangguan, Dongkai

Subjects: Lead-free electronics manufacturing processes; Microelectronic packaging--Reliability; Solder and solderingTECHNOLOGY & ENGINEERING / Electronics / Microelectronics; TECHNOLOGY & ENGINEERING / Electronics / Digital

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EFFECT OF Ni-DEPOSITED CARBON NANOTUBES ON MORPHOLOGY AND SHEAR STRENGTH OF LEAD-FREE SOLDER JOINTS.

• Authors : Poverzhuk, V.¹; Plevachuk, Yu.^1,2; Švec Sr., P.²

• Source: Journal of Physical Studies. 2024, Vol. 28 Issue 3, p3602-1-3602-6. 6p.

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The Influence of Reflowing Process on Electrodeposited Sn-Cu-Ni Lead-Free Solder Alloy.

• Authors : State, Sabrina Patricia^1,2,3 (AUTHOR) ; Costovici, Stefania³ (AUTHOR) ; Enachescu, Marius³ (AUTHOR)

• Source: Materials (1996-1944). Mar2024, Vol. 17 Issue 5, p1034. 14p.

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Accelerated discovery of lead-free solder alloys with enhanced creep resistance via complementary machine learning strategy

• Authors : Zhengheng Lian; Youyang Chen; Chao Zhou

Subjects: Lead-free solder alloys; Machine learning; Creep resistance

• Source: Journal of Materials Research and Technology, Vol 32, Iss , Pp 1256-1267 (2024)

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A SHORT REVIEW ON THE INFLUENCE OF ANTIMONY ADDITION TO THE MICROSTRUCTURE AND THERMAL PROPERTIES OF LEAD-FREE SOLDER ALLOY.

• Authors : ZAIMI, NUR SYAHIRAH MOHAMAD¹; SALLEH, MOHD ARIF ANUAR MOHD¹ ; AL BAKRI ABDULLAH, MOHD MUSTAFA¹

• Source: Archives of Metallurgy & Materials. 2023, Vol. 68 Issue 3, p981-986. 6p.

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Effect of Different Ga Contents on the Acid and Alkaline Resistance of New SnInAg Lead-Free Solder Alloy

• Authors : REN Pengkai, XU Dongxia, CAO Fulei, CHU Yadong, ZHANG Hongxia

Subjects: lead -free solder；sn -in -ag alloy；ga；corrosion resistance; Materials of engineering and construction. Mechanics of materials; TA401-492

• Source: Cailiao Baohu, Vol 57, Iss 5, Pp 25-32 (2024)

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Synthesis and analysis of the structure of modified-Al2O3 particles used to increase the strength and electrical conductivity of lead-free solder based on Sn–Ag–Cu.

• Authors : Wang, Bingying^1,2 (AUTHOR); Zhang, Keke¹ (AUTHOR) ; Gao, Yijie¹ (AUTHOR)

• Source: Journal of Materials Science. Jun2023, Vol. 58 Issue 22, p9382-9393. 12p. 1 Color Photograph, 2 Black and White Photographs, 6 Graphs.

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Reliability modeling of the fatigue life of lead-free solder joints at different testing temperatures and load levels using the Arrhenius model.

• Authors : Bani Hani, Dania¹ (AUTHOR) ; Al Athamneh, Raed² (AUTHOR); Abueed, Mohammed³ (AUTHOR)

• Source: Scientific Reports. 5/9/2023, Vol. 13 Issue 1, p1-13. 13p.

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The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder

• Authors : Sunwu Xu; Yifei Li; Xinyi Jing

Subjects: Sn-Bi-In alloy; Low-melting lead-free solder; Microstructure

• Source: Journal of Materials Research and Technology, Vol 29, Iss , Pp 2272-2278 (2024)

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A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy

• Authors : Nur Syahirah Mohamad Zaimi; Mohd Arif Anuar Mohd Salleh; Mohd Mustafa Al Bakri Abdullah

Subjects: lead-free solder; antimony; microstructure

• Source: Archives of Metallurgy and Materials, Vol vol. 68, Iss No 3, Pp 981-986 (2023)

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