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Heterogeneous integration of single InAs/InP quantum dots with the SOI chip using direct bonding

Subjects: article

  • Source: Burakowski , M , Holewa , P , MrowińSki , P , Sakanas , A , Musiał , A , Sek , G , Yvind , K , Semenova , E & Syperek , M 2024 , ' Heterogeneous integration of single

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