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Thermal Conductivity Enhancement of Doped Magnesium Hydroxide for Medium-Temperature Heat Storage: A Molecular Dynamics Approach and Experimental Validation.

• Authors : Kur A; Buildings, Energy and Environment Research Group, Faculty of Engineering, University of Nottingham, University Park, Nottingham NG7 2RD, UK.; Darkwa J

Subjects: Thermal Conductivity* ; Magnesium Hydroxide*/Magnesium Hydroxide*/Magnesium Hydroxide*/chemistry ; Molecular Dynamics Simulation*

• Source: International journal of molecular sciences [Int J Mol Sci] 2024 Oct 17; Vol. 25 (20). Date of Electronic Publication: 2024 Oct 17.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101092791 Publication Model: Electronic Cited Medium: Internet ISSN: 1422-0067

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Aqueous Theta-Phase Aluminum Oxide Nanofluid for Energy Applications: Experimental Study on Thermal Conductivity

• Authors : Alejandro Zacarías; Mercedes de Vega; Néstor García-Hernando

Subjects: thermal conductivity; aqueous theta-phase aluminum oxide; nanofluids

• Source: Applied Sciences, Vol 14, Iss 8, p 3225 (2024)

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Thermal Conductivity of Ionic Liquid-Based Nanofluids Containing Magnesium Oxide and Aluminum Oxide Nanoparticles.

• Authors : Hothar, Marcus¹ (AUTHOR); Wu, Zan¹ (AUTHOR); Sundén, Bengt¹ (AUTHOR)

• Source: Heat Transfer Engineering. 2022, Vol. 43 Issue 21, p1806-1819. 14p.

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DIW-Printed Thermal Management PDMS Composites with 3D Structural Thermal Conductive Network of h-BN Platelets and Al 2 O 3 Nanoparticles.

• Authors : Zhu, Hongyi¹ (AUTHOR) ; Wu, Shunxia¹ (AUTHOR); Tang, Rui¹ (AUTHOR)

Subjects: *ALUMINUM oxide; *THERMAL conductivity; *BLOOD platelets

• Source: Polymers (20734360). Jun2024, Vol. 16 Issue 11, p1491. 15p.

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The Effect of Porosity on the Thermal Conductivity of Highly Thermally Conductive Adhesives for Advanced Semiconductor Packages.

• Authors : Choi, Hyun-Seok¹ (AUTHOR) ; Park, Jeong-Hyun¹ (AUTHOR); Lee, Jong-Hee¹ (AUTHOR)

Subjects: *THERMAL conductivity; *ALUMINUM nitride; *POROSITY

• Source: Polymers (20734360). Jul2023, Vol. 15 Issue 14, p3083. 10p.

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Radiative Colloidal Investigation for Thermal Transport by Incorporating the Impacts of Nanomaterial and Molecular Diameters (d Nanoparticles , d Fluid ): Applications in Multiple Engineering Systems.

• Authors : Ahmed N; Department of Mathematics, Faculty of Sciences, HITEC University, Taxila Cantt 47070, Pakistan.; Adnan

Subjects: Thermal Conductivity*; Colloids/Colloids/Colloids/*chemistry ; Nanostructures/Nanostructures/Nanostructures/*chemistry

• Source: Molecules (Basel, Switzerland) [Molecules] 2020 Apr 20; Vol. 25 (8). Date of Electronic Publication: 2020 Apr 20.Publisher: MDPI Country of Publication: Switzerland NLM ID: 100964009 Publication Model: Electronic Cited Medium: Internet ISSN: 1420-3049

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Fabrication and Characterization of Al 2 O 3 -Siloxane Composite Thermal Pads for Thermal Interface Materials.

• Authors : Kim, Seul-Ki^1,2 (AUTHOR) ; Koo, Yeong-Jin¹ (AUTHOR) ; Kim, Hyun Sik³ (AUTHOR)

• Source: Materials (1996-1944). Feb2024, Vol. 17 Issue 4, p914. 20p.

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Flat plate solar collector performance using alumina nanofluids: Experimental characterization and efficiency tests.

• Authors : Mondragón R; Departamento de Ingeniería Mecánica y Construcción, Universitat Jaume I, Castellón de la Plana, Spain.; Sánchez D

Subjects: Solar Energy* ; Sunlight* ; Thermal Conductivity*

• Source: PloS one [PLoS One] 2019 Feb 22; Vol. 14 (2), pp. e0212260. Date of Electronic Publication: 2019 Feb 22 (Print Publication: 2019).Publisher: Public Library of Science Country of Publication: United States NLM ID: 101285081 Publication Model: eCollection Cited Medium: Internet

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Fabrication, Thermal Conductivity, and Mechanical Properties of Hexagonal-Boron-Nitride-Pattern-Embedded Aluminum Oxide Composites

• Authors : Hyesun Yun; Min-Gi Kwak; KeumHwan Park

Subjects: aluminum oxide; hexagonal boron nitride; thermal conductivity

• Source: Nanomaterials, Vol 12, Iss 16, p 2815 (2022)

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Effect of the alumina micro-particle sizes on the thermal conductivity and dynamic mechanical property of epoxy resin.

• Authors : Xu, Zhe¹ (AUTHOR); Zhang, Cheng² (AUTHOR); Li, Yang¹ (AUTHOR)

Subjects: *THERMAL conductivity; *EPOXY resins; *DYNAMIC mechanical analysis

• Source: PLoS ONE. 10/13/2023, Vol. 18 Issue 10, p1-17. 17p.

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