نتائج البحث

High-Temperature Electronics Packaging for Simulated Venus Condition.

• Authors : Nasiri, Ardalan¹; Ang, Simon S.¹; Cannon, Tom¹

• Source: Journal of Microelectronic & Electronic Packaging. Apr2020, Vol. 17 Issue 2, p59-66. 8p.

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Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique.

• Authors : Zhong, Z.W.¹ ; Wong, K.W.¹; Shi, X.Q.²

• Source: International Journal of Advanced Manufacturing Technology. Jan2006, Vol. 27 Issue 7/8, p708-714. 7p. 2 Black and White Photographs, 2 Diagrams, 10 Graphs.

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Achieving High Aspect Ratio TSVs.

• Authors : Eisenhammer, Thomas

• Source: Advanced Packaging. Mar2008, Vol. 17 Issue 2, p42-44. 3p.

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Wafer Level Packaging of Compound Semiconductors.

• Authors : Strandjord, Andrew; Teutsch, Thorsten; Scheffler, Axel

• Source: Journal of Microelectronic & Electronic Packaging. 2010 3rd Quarter, Vol. 7 Issue 3, p152-159. 8p. 9 Color Photographs, 5

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Assembly Process Development for Fine Pitch Flip Chip Silicon-to-Silicon 3D Wafer Level Integration with No Flow Underfill.

• Authors : Zhaozhi Li¹ ; Sangil Lee²; Lewis, Brian J.³

• Source: Journal of Microelectronic & Electronic Packaging. 2010 3rd Quarter, Vol. 7 Issue 3, p146-151. 6p. 12 Black and White

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Ohm's Law Survives to the Atomic Scale.

• Authors : Weber, B.¹; Mahapatra, S.¹; Ryu, H.²

• Source: Science. 1/6/2012, Vol. 335 Issue 6064, p64-67. 4p.

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Opto-WLP Technology.

• Authors : Lein, Juergen¹ ; Seidemann, Volker²

• Source: Advanced Packaging. May/Jun2006, Vol. 15 Issue 5, p28-30. 2p.

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ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications.

• Authors : McCutcheon, Jeremy; Brown, Robert; Dachsteiner, JoElle

Subjects: MANUFACTURING processes; SEMICONDUCTOR wafers; SEALING (Technology)BREWER Science Inc.

• Source: Journal of Microelectronic & Electronic Packaging; 2010 3rd Quarter, Vol. 7 Issue 3, p138-142, 5p, 7 Black and White Photographs, 2

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Technology Investment Strategies to Meet Future Product Needs.

• Authors : Grayeli, Nasser

• Source: Advanced Packaging. Mar2007, Vol. 16 Issue 2, p44-44. 1p.

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Materials Compatibility Enables Next-Gen Performance in Packaging.

• Authors : Grayeli, Nasser¹

• Source: Advanced Packaging. Jun2005, Vol. 14 Issue 6, p36-36. 1p.

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