نتائج البحث

Design of magnetic dipole based 3D integration nano-circuits for future electronics application.

• Authors : Bhoi, Bandan Kumar¹; Misra, Neeraj Kumar² ; Pradhan, Manoranjan¹

• Source: International Journal of Nano Dimension. Autumn2018, Vol. 9 Issue 4, p374-385. 12p.

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Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires.

• Authors : Wu, Phillip M.¹ ; Samuelson, Lars¹; Linke, Heiner¹

• Source: Journal of Nanomaterials. 2011, p1-5. 5p. 2 Black and White Photographs, 3 Graphs.

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ATOMIC-LAYER-DEPOSITED INDIUM OXIDE TRANSISTORS FOR BACK-END-OF-LINE MONOLITHIC 3D INTEGRATION

• Authors : Zhuocheng Zhang

Subjects: Nanoelectronics; Atomic Layer Deposition; Indium Oxide

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Toward 3D Integration of 1D Conductors: Junctions of InAs Nanowires

• Authors : Phillip M. Wu; Heiner Linke; Lars Samuelson

Subjects: Materials science; Article Subject; business.industry

• Source: Journal of Nanomaterials, Vol 2011 (2011)

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Wildly Heterogeneous Post-CMOS Technologies Meet Software (Dagstuhl Seminar 17061)

• Authors : Kuo, Tei-Wei; Riel, Heike E.; Lieber, Matthias

Subjects: 3D integration; compilers; emerging post-CMOS circuit materials and technologies

• Source: Dagstuhl Reports, Volume 7, Issue 2; ISSN 2192-5283

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Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration ; Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense

• Authors : Ouerghi, Issam;

Subjects: Nanowire; Nems; Piezoresistivity

• Source: https://theses.hal.science/tel-01269704 ; Micro et nanotechnologies/Microélectronique. Université Grenoble Alpes, 2015. Français. ⟨NNT : 2015GREAT119⟩.

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Realistic limits to computation.

• Authors : Cerofolini, G.¹

• Source: Applied Physics A: Materials Science & Processing. Mar2012, Vol. 106 Issue 4, p967-982. 16p. 7 Diagrams, 2 Graphs.

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Etude de NEMS à nanofils polycristallins pour la détection et l’intégration hétérogène 3D ultra-dense ; Study of polycrystalline nanowire based NEMS for detection and ultra-dense 3D heterogeneous integration

• Authors : Ouerghi, Issam;

Subjects: Nanofil; Nems; Piezorésistivité620

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3D integration drives nanoelectronics.

• Authors : Nelson, Rick

• Source: EE: Evaluation Engineering. Oct2015, Vol. 54 Issue 10, p24-24. 1p.

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A Fabrication Process for Emerging Nanoelectronic Devices Based on Oxide Tunnel Junctions.

• Authors : Drouin, Dominique^1,2; Droulers, Gabriel^1,2; Labalette, Marina^1,2

• Source: Journal of Nanomaterials. 2/23/2017, p1-8. 8p.

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