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Subject : integrated circuit interconnections

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Academic Journal

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.

Authors : XU, Zhao-Pei¹; WANG, Kang-Jia¹

Source: Thermal Science. 2023, Vol. 27 Issue 3B, p2391-2398. 8p.

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Academic Journal

Design thinking and inquiry behaviours are co-constituted in a community of inquiry middle years' science classroom context: Empirical evidence for design thinking and pragmatist inquiry interconnections.

Authors : Nichols, Kim¹ ; Musofer, Reshma¹; Fynes-Clinton, Liz¹

Source: International Journal of Technology & Design Education. Nov2022, Vol. 32 Issue 5, p2527-2551. 25p.

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Academic Journal

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.

Authors : WANG, Kang-Jia¹; HUA, Chu-Xia²; SUN, Hong-Chang^3,4

Source: Thermal Science. 2019, Vol. 23 Issue 4, p2157-2162. 6p.

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Academic Journal

Novel Subthreshold Modelling of Advanced On-Chip Graphene Interconnect Using Numerical Method Analysis.

Authors : Patel, Nikita R.¹ (AUTHOR) ; Agrawal, Yash¹ (AUTHOR) ; Parekh, Rutu¹ (AUTHOR)

Source: IETE Journal of Research. Jan-Feb2021, Vol. 67 Issue 1, p98-107. 10p.

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Academic Journal

Primary Frequency Regulation with Battery Energy Storage Systems in the Ecuadorian Power System.

Authors : Chamba, M. S.¹ ; Vargas, W.¹ ; Echeverría, D.²

Source: Leonardo. Jul2022, Vol. 55 Issue 4, p13-21. 9p. 4 Diagrams, 3 Charts, 5 Graphs.

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Academic Journal

Opportunities and conditions to learn (OCL): A conceptual framework.

Authors : Perry, Laura B.¹, ; Thier, Michael^2,3; Beach, Paul⁴

Source: Prospects (00331538); Mar2024, Vol. 54 Issue 1, p55-72, 18p

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Academic Journal

Toxicity remission of PAEs on multireceptors after molecular modification through a 3D-QSAR pharmacophore model coupled with a gray interconnect degree method.

Authors : Xinyi CHEN¹; Yu LI¹

Source: Turkish Journal of Chemistry. 2021, Vol. 45 Issue 2, p307-322. 16p.

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Academic Journal

A survey on pristine and intercalation doped graphene nanoribbon interconnect for future VLSI circuits.

Authors : Das, Subhajit¹ ; Bhattacharya, Sandip²; Das, Debaprasad³

Source: AIMS Materials Science. 2021, Vol. 8 Issue 2, p247-260. 14p.

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Academic Journal

A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly.

Authors : Capuz, Giovanni¹ ; Lofrano, Melina¹; Gerets, Carine¹

Source: Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 1, p12-20. 9p.

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Academic Journal

Optimized buffer insertion for efficient interconnects designs.

Authors : Khursheed, Afreen¹ (AUTHOR) ; Khare, Kavita² (AUTHOR)

Source: International Journal of Numerical Modelling. Sep/Oct2020, Vol. 33 Issue 5, p1-18. 18p.

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فلترة النتائج

AN ANALYTICAL THERMAL MODEL FOR THE 3-D INTEGRATED CIRCUIT WITH NEW-TYPE THROUGH SILICON VIA.

Design thinking and inquiry behaviours are co-constituted in a community of inquiry middle years' science classroom context: Empirical evidence for design thinking and pragmatist inquiry interconnections.

THERMAL MANAGEMENT OF THE THROUGH SILICON VIAS IN 3-D INTEGRATED CIRCUITS.

Novel Subthreshold Modelling of Advanced On-Chip Graphene Interconnect Using Numerical Method Analysis.

Primary Frequency Regulation with Battery Energy Storage Systems in the Ecuadorian Power System.

Opportunities and conditions to learn (OCL): A conceptual framework.

Toxicity remission of PAEs on multireceptors after molecular modification through a 3D-QSAR pharmacophore model coupled with a gray interconnect degree method.

A survey on pristine and intercalation doped graphene nanoribbon interconnect for future VLSI circuits.

A Novel Method for Characterization of Ultralow Viscosity NCF Layers Using TCB for 3D Assembly.

Optimized buffer insertion for efficient interconnects designs.

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