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Hybrid bonding for 3D integration : challenges of the pitch shrinkage ; Intégration 3D par collage hybride : défis de la miniaturisation du pas d’interconnexion

• Authors : Jourdon, Joris;

Subjects: Hybrid bonding; 3D integration; Fine pitch

• Source: https://theses.hal.science/tel-03013487 ; Electronique. Université de Bordeaux, 2019. Français. ⟨NNT : 2019BORD0234⟩.

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Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting.

• Authors : Meng, Ying^1,2 (AUTHOR) ; Gao, Runhua¹ (AUTHOR) ; Wang, Xinhua^1,2,3 (AUTHOR)

• Source: Materials (1996-1944). Apr2022, Vol. 15 Issue 7, p2529-2529. 11p.

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Direct Bonding Method for Completely Cured Polyimide by Surface Activation and Wetting

• Authors : Ying Meng; Runhua Gao; Xinhua Wang

Subjects: polyimide bonding; plasma activation; hydrophilic

• Source: Materials; Volume 15; Issue 7; Pages: 2529

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Contribution à la fiabilisation des interconnexions 3D dans le cadre du développement des capteurs photographiques

• Authors : Moreau, Stephane;

Subjects: Reliability; Robustness; 3D integration

• Source: https://cea.hal.science/tel-04524276 ; Sciences de l'ingénieur [physics]. Université Grenoble Alpes (UGA), 2024.

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Electrical and morphological characterizations of the hybrid bonding level down to submicron pitches ; Caractérisation morphologique et électrique du collage hybride jusqu'aux pas submicroniques

• Authors : Ayoub, Bassel;

Subjects: Intégration 3D; Collage hybride; Fiabilité

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A True Process-Heterogeneous Stacked Embedded DRAM Structure Based on Wafer-Level Hybrid Bonding

• Authors : Song Wang; Xiping Jiang; Fujun Bai

Subjects: high bandwidth; 3DIC; hybrid bonding

• Source: Electronics; Volume 12; Issue 5; Pages: 1077

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Scanning Acoustic Microscopy versus Colored Picosecond Acoustics to detect interface defects in hybrid wafer bonding

• Authors : Bossut, Solene; Devos, Arnaud; Lhostis, S ...

Subjects: Hybrid bonding; Scanning Acoustic Microscopy; Picosecond AcousticsLyon; France

• Source: Forum Acusticum ; https://hal.science/hal-03240341 ; Forum Acusticum, Dec 2020, Lyon, France. pp.2553-2554, ⟨10.48465/fa.2020.0878⟩

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Cu/Cu bonding and SiO2/SiO2 bonding by surface activated bonding at room temperature for hybrid bonding technique

• Authors : Jun UTSUMI; Kensuke IDE

Subjects: surface activated bonding; room temperature bonding; bonding interface

• Source: Nihon Kikai Gakkai ronbunshu, Vol 81, Iss 831, Pp 15-00408-15-00408 (2015)

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Numerical and Experimental Investigations on Mechanical Stress in 3D Stacked Integrated Circuits for Imaging Applications ; Etude expérimentale et numérique des contraintes mécaniques dans les architectures tridimensionnelles sur silicium pour les applications d'imagerie

• Authors : Sart, Clément;

Subjects: Piezoresistive Stress Sensors; Hybrid Bonding; Finite Element Modeling

• Source: https://theses.hal.science/tel-02517015 ; Chemical and Process Engineering. Université Grenoble Alpes, 2019. English. ⟨NNT : 2019GREAI084⟩.

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