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Bicrystallography-informed Frenkel–Kontorova model for interlayer dislocations in strained 2D heterostructures

• Authors : Ahmed, Tusher; Wang, Chenhaoyue; Banerjee, Amartya S

Subjects: Civil Engineering; Engineering; Materials Engineering

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4D STEM data of the Publication - A Small Step for Epitaxy, a Large Step Towards Twist Angle Control in 2D Heterostructures

• Authors : Maßmeyer, Oliver Dr.

Subjects: 4D STEM; WS2; 2D Materials

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Ghost anti-crossings caused by interlayer umklapp hybridization of bands in 2D heterostructures

• Authors : Johanna Zultak; Cuauhtémoc Salazar; Roman V. Gorbachev

Subjects: Materials science; Photoemission spectroscopy; TK

• Source: 2D Materials

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Exciton engineering with 2D heterostructures

• Authors : Moreno Abajo, Álvaro;

Subjects: quantum emitters; Condensed Matter::Other; Enginyeria de la telecomunicació [Àrees temàtiques de la UPC]

• Source: UPCommons. Portal del coneixement obert de la UPCUniversitat Politècnica de Catalunya (UPC)

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Band gap predictions for 2.2 million 2D heterostructures

• Authors : David Winkler (4602496); Joe Shapter (5229758); Mike J Ford (6901709)

Subjects: Molecular Physics; Cheminformatics; Computational Chemistry

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Editorial: Design of two-dimensional functional materials and nanodevices

• Authors : Guangzhao Wang; Junjie He; Xiaotian Wang

Subjects: 2D materials; 2D heterostructures; nanodevices

• Source: Frontiers in Materials, Vol 9 (2022)

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Raman Fingerprint of Interlayer Coupling in 2D TMDCs

• Authors : Yang Pan; Dietrich R. T. Zahn

Subjects: 2D materials; TMDCs; 2D heterostructures

• Source: Nanomaterials; Volume 12; Issue 22; Pages: 3949

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Scalable Fabrication of 2D Semiconducting Crystals for Future Electronics

• Authors : Li, Jiantong; Östling, Mikael

Subjects: 2D materials; transition metal dichalcogenides; field effect transistors

• Source: Electronics. 4(4):1033-1061

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Heterogeneous Integration Technologies Based on Wafer Bonding and Wire Bonding for Micro and Nanosystems

• Authors : Wang, Xiaojing;

Subjects: Micro-electromechanical systems (MEMS); heterogeneous integration; wafer bonding

• Source: TRITA-EECS-AVL.

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A perspective on the application of spatially resolved ARPES for 2D materials

• Authors : Cattelan, Mattia; Fox, Neil A.

Subjects: 2D heterostructures; 2D materials; Band structure

• Source: Cattelan , M & Fox , N A 2018 , ' A perspective on the application of spatially resolved ARPES for 2D materials ' , Nanomaterials , vol. 8 , no. 5 , 284 .

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