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Electronic Resource

Optimal microstructural design for high thermal stability of pure FCC metals based on studying effect of twin boundaries character and network of grain boundaries

Subjects: Nickel; Annealing; Electrodeposition

  • Source: Alimadadi , H , Fanta , A B , Akiyoshi , R , Kasama , T , Rollett , A D , Somers , M A J & Pantleon , K 2018 , ' Optimal microstructural design for high thermal stability of pure FCC metals based on

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