نتائج البحث

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy.

• Authors : Tao, Q.B.¹ (AUTHOR) ; Benabou, L.² (AUTHOR); Le, Van Nhat² (AUTHOR)

• Source: Fatigue & Fracture of Engineering Materials & Structures. Dec2020, Vol. 43 Issue 12, p2883-2891. 9p.

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Vapour Pressure Modelling for Plastic Encapsulated Microelectronics Subjected to Lead-Free Solder Reflow Profile.

• Authors : Wang, Z.¹

• Source: Strain. Jun2011 Supplement, Vol. 47, pe148-e155. 8p. 3 Diagrams, 3 Graphs.

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Experimental and numerical studies on size and constraining effects in lead-free solder joints.

• Authors : CUGNONI, J.¹ ; BOTSIS, J.¹; SIVASUBRAMANIAM, V.^1,2

• Source: Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p387-399. 13p. 12 Diagrams, 1 Chart, 7 Graphs.

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The influence of phase transition on electrocaloric effect in lead-free (Ba0.9Ca0.1)(Ti1− x Zr x)O3 ceramics.

• Authors : Nie, Xin^1,2; Yan, Shiguang¹; Guo, Shaobo¹

• Source: Journal of the American Ceramic Society. Nov2017, Vol. 100 Issue 11, p5202-5210. 9p.

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Phase, domain, and microstructures in Sr2+ substituted low‐temperature sintering PZT‐based relaxor ferroelectrics.

• Authors : Chen, Hao; Xing, Jie; Xi, Jingwen

Subjects: DIELECTRIC relaxation; RELAXOR ferroelectrics; PIEZOELECTRIC devices

• Source: Journal of the American Ceramic Society; Dec2021, Vol. 104 Issue 12, p6266-6276, 11p, 1 Color Photograph, 1 Diagram, 2 Charts, 6 Graphs

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Low-cycle fatigue properties of eutectic solders at high temperatures.

• Authors : KARIYA, YOSHIHARU¹ ; SUGA, TADATOMO²

• Source: Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p413-419. 7p. 6 Diagrams, 7 Graphs.

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Effect of strain waveform on creep-fatigue life for Sn–8Zn–3Bi solder.

• Authors : YAMAMOTO, T.¹ ; IWATA, M.²; SAKANE, M.²

• Source: Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p376-386. 11p. 4 Diagrams, 4 Charts, 10 Graphs.

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