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Publisher : springer nature

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Academic Journal

Time-bin entanglement at telecom wavelengths from a hybrid photonic integrated circuit.

Authors : Thiel, Hannah¹ (AUTHOR) ; Jehle, Lennart^2,3 (AUTHOR); Chapman, Robert J.^1,4 (AUTHOR)

Source: Scientific Reports. 5/1/2024, Vol. 14 Issue 1, p1-7. 7p.

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Academic Journal

Two-ways chip to chip communications through 2-dimensional photonic structures via photonic integrated circuit.

Authors : Sivakumar, S. A.¹ (AUTHOR) ; Naveen, R.² (AUTHOR); Ibrahim, S. Jafar Ali³ (AUTHOR)

Source: Optical & Quantum Electronics. Jul2023, Vol. 55 Issue 7, p1-18. 18p.

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Academic Journal

Extremely large area (88 mm × 88 mm) superconducting integrated circuit (ELASIC).

Authors : Das, Rabindra N.¹ (AUTHOR) ; Bolkhovsky, Vladimir¹ (AUTHOR); Wynn, Alex¹ (AUTHOR)

Source: Scientific Reports. 7/21/2023, Vol. 13 Issue 1, p1-9. 9p.

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Academic Journal

Addressable superconductor integrated circuit memory from delay lines.

Authors : Volk, Jennifer^1,2 (AUTHOR) ; Wynn, Alex² (AUTHOR); Golden, Evan² (AUTHOR)

Source: Scientific Reports. 11/18/2023, Vol. 13 Issue 1, p1-11. 11p.

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Academic Journal

Addressable superconductor integrated circuit memory from delay lines.

Authors : Volk, Jennifer^1,2 (AUTHOR) ; Wynn, Alex² (AUTHOR); Golden, Evan² (AUTHOR)

Source: Scientific Reports. 10/3/2023, Vol. 13 Issue 1, p1-11. 11p.

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Academic Journal

Controllable hybrid plasmonic integrated circuit.

Authors : Khodadadi, Maryam¹ (AUTHOR); Moshiri, Seyyed Mohammad Mehdi¹ (AUTHOR); Nozhat, Najmeh¹ (AUTHOR)

Source: Scientific Reports. 6/20/2023, Vol. 13 Issue 1, p1-20. 20p.

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Academic Journal

Monolithic multicomponent integrated circuit with an arc-shape waveguide on Si substrate.

Authors : Cai, Wei^1,2 (AUTHOR) ; Jiao, Liangbao² (AUTHOR); Guo, Eryuan² (AUTHOR)

Source: Applied Physics A: Materials Science & Processing. May2023, Vol. 129 Issue 5, p1-8. 8p. 3 Diagrams, 4 Graphs.

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Academic Journal

High-performance fieldbus application-specific integrated circuit design for industrial smart sensor networks.

Authors : Chen, Ching-Han¹ ; Lin, Ming-Yi¹ ; Guo, Xing-Chen¹

Source: Journal of Supercomputing. Sep2018, Vol. 74 Issue 9, p4451-4469. 19p.

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Academic Journal

Ultra-compact and low delay time all optical half adder based on photonic crystals.

Authors : Parandin, Fariborz¹ (AUTHOR)

Source: Optical & Quantum Electronics. May2023, Vol. 55 Issue 5, p1-11. 11p.

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Academic Journal

Electrochemical deposition of contact structures for integrated circuit packaging.

Authors : Roshchin, V.¹ ; Dshkhunyan, V.²; Petukhov, I.¹

Source: Inorganic Materials. Mar2015, Vol. 51 Issue 3, p294-298. 5p.

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نتائج البحث

فلترة النتائج

Time-bin entanglement at telecom wavelengths from a hybrid photonic integrated circuit.

Two-ways chip to chip communications through 2-dimensional photonic structures via photonic integrated circuit.

Extremely large area (88 mm × 88 mm) superconducting integrated circuit (ELASIC).

Addressable superconductor integrated circuit memory from delay lines.

Addressable superconductor integrated circuit memory from delay lines.

Controllable hybrid plasmonic integrated circuit.

Monolithic multicomponent integrated circuit with an arc-shape waveguide on Si substrate.

High-performance fieldbus application-specific integrated circuit design for industrial smart sensor networks.

Ultra-compact and low delay time all optical half adder based on photonic crystals.

Electrochemical deposition of contact structures for integrated circuit packaging.

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