نتائج البحث

Fabrication of SiCp/Cu-Al electronic packaging material by pressureless infiltration method.

• Authors : Yang, L.; Zhang, M.

Subjects: MICROFABRICATION; SILICON compounds; ALUMINUM-copper alloys

• Source: Journal of Materials Science & Technology; Mar2013, Vol. 29 Issue 3, p326-331, 6p

تفاصيل العنوان

A novel concept for improved thermal management of the planar SOFC.

• Authors : Vijay, Periasamy¹ ; Hosseini, Shahin¹ ; Tadé, Moses O.¹

• Source: Chemical Engineering Research & Design: Transactions of the Institution of Chemical Engineers Part A. Mar2013, Vol. 91 Issue 3, p560-572. 13p.

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