نتائج البحث

Calculating topological indices of certain OTIS interconnection networks

• Authors : Aslam Adnan; Ahmad Safyan; Binyamin Muhammad Ahsan

Subjects: optical transpose interconnection system (otis) network; otis swapped networks; otis biswapped networks

• Source: Open Chemistry, Vol 17, Iss 1, Pp 220-228 (2019)

تفاصيل العنوان

7 Biophilia, one health, and humane education: Mitigating global risk through embracing humanity’s interconnection with the natural world

• Authors : Spanjol, Kimberly; Zucca, Paolo

• Source: Socio-Political Risk Management ; page 109-130 ; ISBN 9783110731217

تفاصيل العنوان

36 Interconnection of Smart Homes and Smart Buildings as a Building Block of Smart Cities

• Authors : Kretz, Daniel; Teich, Tobias; Franke, Daniel

• Source: Innovations and challenges of the energy transition in smart city districts ; page 595-610 ; ISBN 9783110777567

تفاصيل العنوان

Post-modification of PLLA nanofiber nonwovens by various solvent treatments

• Authors : Götz Andreas; Reske Thomas; Oschatz Stefan

Subjects: fiber interconnection; solvent influence; tailored morphology

• Source: Current Directions in Biomedical Engineering, Vol 9, Iss 1, Pp 495-498 (2023)

تفاصيل العنوان

The structure fault tolerance of burnt pancake networks

• Authors : Ge Huifen; Ye Chengfu; Zhang Shumin

Subjects: interconnection networks; h-structure connectivity; h-substructure connectivity

• Source: Open Mathematics, Vol 21, Iss 1, Pp 195-199 (2023)

تفاصيل العنوان

On topological properties of block shift and hierarchical hypercube networks

• Authors : Guirao Juan Luis García; Siddiqui Muhammad Kamran; Hussain Asif

Subjects: hyper zagreb index; first multiplicative zagreb index; second multiplicative zagreb index

• Source: Open Physics, Vol 16, Iss 1, Pp 810-819 (2018)

تفاصيل العنوان

On synchrony in dynamic distributed systems

• Authors : Muñoz-Escoí Francesc D.; de Juan-Marín Rubén

Subjects: distributed system; dynamic system; system interconnection

• Source: Open Computer Science, Vol 8, Iss 1, Pp 154-164 (2018)

تفاصيل العنوان

Device- and service profiles for integrated or systems based on open standards

• Authors : Mildner Alexander; Janß Armin; Dell’Anna-Pudlik Jasmin

Subjects: accreditation strategies; medical device integration; dynamic interconnection

• Source: Current Directions in Biomedical Engineering, Vol 1, Iss 1, Pp 538-542 (2015)

تفاصيل العنوان

Study on the reliability of nano-silver-coated tin solder joints for flip chips

• Authors : Yang Hui; Chen Wenhui

Subjects: flip chip; nano-silver-coated tin; fatigue life

• Source: Green Processing and Synthesis, Vol 12, Iss 1, Pp 4541-53 (2023)

تفاصيل العنوان

Das Ytterbium(III)-Oxidbromid-Oxidotellurat(IV) Yb3O2Br[TeO3]2.

• Authors : Meier, Steffen F.¹ (AUTHOR); Russ, Philip L.¹ (AUTHOR); Schleid, Thomas¹ (AUTHOR)

• Source: Zeitschrift für Naturforschung B: A Journal of Chemical Sciences. Aug2020, Vol. 75 Issue 8, p791-797. 7p.

تفاصيل العنوان