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NEW EDITOR APPOINTED FOR ASME JOURNAL OF ELECTRONIC PACKAGING.

• Source: Mechanical Engineering. Sep2020, Vol. 142 Issue 9, p63-63. 1/3p.

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Pushing the design envelope with CAE.

• Authors : Halpern, Marc

• Source: Mechanical Engineering. Nov98, Vol. 120 Issue 11, p66. 6p. 2 Color Photographs, 1 Graph.

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Essentials of Electronic Packaging.

• Source: Mechanical Engineering. May2011, Vol. 133 Issue 5, p49-49. 1/4p.

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Reducing time to market in electronic packaging.

• Authors : Fusaro, James

• Source: Mechanical Engineering. Jun96, Vol. 118 Issue 6, p70. 4p. 3 Color Photographs.

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FREEFORM FLUIDICS.

• Authors : LOVE, LONNIE J.; RICHARDSON, BRADLEY; LIND, RANDALL

Subjects: DYNAMICAL systems; INDUSTRIAL revolution; THREE-dimensional printing

• Source: Mechanical Engineering; Jun2013, Vol. 135 Issue 6, Special section p17-20, 4p

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Experimental SAC305 shear stress-strain hysteresis loop construction using Hall's one-dimensional model based on strain gages measurements

• Authors : Libot, Jean-Baptiste; Alexis, Joël; Dalverny, Olivier ...

Subjects: Lead-free solder; Hysteresis; Thermal cycling

• Source: ISSN: 1043-7398 ; Journal of Electronic Packaging ; https://hal.science/hal-02359785 ; Journal of

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Solid-State Microrefrigeration in Conjunction With Liquid Cooling

• Authors : Ezzahri, Younes; Shakouri, Ali;

Subjects: [SPI]Engineering Sciences [physics]; [PHYS]Physics [physics]

• Source: ISSN: 1043-7398 ; Journal of Electronic Packaging ; https://hal.science/hal-04129733 ; Journal of

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Modeling the thermal actuation in a thermo-pneumatic micropump

• Authors : Carmona, M.; Marco, S.; Samitier, Josep

Subjects: Actuators; Pneumatic systems; Micropumps

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