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Academic Journal

Electrochemical deposition of contact structures for integrated circuit packaging.

Authors : Roshchin, V.¹ ; Dshkhunyan, V.²; Petukhov, I.¹

Source: Inorganic Materials. Mar2015, Vol. 51 Issue 3, p294-298. 5p.

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Academic Journal

集成电路工艺实验教学的探索与实践.

Authors : 李建军¹ ; 王姝娅¹; 杜涛¹

Source: Research & Exploration in Laboratory. 2015, Vol. 34 Issue 11, p162-165. 4p.

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Academic Journal

Securing Health Sensing Using Integrated Circuit Metric.

Authors : Tahir, Ruhma¹ ; Tahir, Hasan¹ ; McDonald-Maier, Klaus¹

Source: Sensors (14248220). Oct2015, Vol. 15 Issue 10, p26621-26642. 22p.

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Academic Journal

APPLICATION OF MULTIPLE OUTPUT DATA ENVELOPMENT ANALYSIS IN INTERPRETING EFFICIENCY IMPROVEMENT OF ENTERPRISE RESOURCE PLANNING IN INTEGRATED CIRCUIT FIRMS.

Authors : Bi-Huei Tsai¹ ; Shin-Bin Chou²

Source: Journal of Developing Areas. Winter2015, Vol. 49 Issue 1, p285-304. 20p.

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Academic Journal

Integrated circuit-packet switching NoC with efficient circuit setup mechanism.

Authors : Pakdaman, Farhad¹ ; Mazloumi, Abbas¹ ; Modarressi, Mehdi

Source: Journal of Supercomputing. Aug2015, Vol. 71 Issue 8, p2787-2807. 21p.

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Academic Journal

An integrated circuit of a universal comparator.

Authors : Dvornikov, O.¹; Chekhovskii, V.²; Dyatlov, V.¹

Source: Instruments & Experimental Techniques. Jul2015, Vol. 58 Issue 4, p483-487. 5p.

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Academic Journal

Parametric yield optimization with mesh adaptive direct search.

Authors : Bűrmen, Árpád¹

Source: Electrotechnical Review / Elektrotehniski Vestnik. 2015, Vol. 82 Issue 4, p191-196. 6p.

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Academic Journal

Process Optimization for 3-D IC Assembly.

Authors : Woychik, Charles G.¹ ; Lee, Sangil¹; McGrath, Scott¹

Source: Journal of Microelectronic & Electronic Packaging. 2015 4th Quarter, Vol. 12 Issue 4, p219-225. 7p.

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Academic Journal

KL_GA: an application mapping algorithm for mesh-of-tree (MoT) architecture in network-on-chip design.

Authors : Fang, Juan¹ ; Yu, Lu¹ ; Liu, Sitong¹

Source: Journal of Supercomputing. Nov2015, Vol. 71 Issue 11, p4056-4071. 16p.

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Academic Journal

A CASE STUDY OF ENCAPSULATED IC ACCELERATED FAILURE DUE TO THE KIRKENDALL EFFECT ON DOWNHOLE CIRCUITS.

Authors : Bescup, John¹

Source: Electronic Device Failure Analysis. Aug2015, Vol. 17 Issue 3, p30-34. 5p.

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فلترة النتائج

Electrochemical deposition of contact structures for integrated circuit packaging.

集成电路工艺实验教学的探索与实践.

Securing Health Sensing Using Integrated Circuit Metric.

APPLICATION OF MULTIPLE OUTPUT DATA ENVELOPMENT ANALYSIS IN INTERPRETING EFFICIENCY IMPROVEMENT OF ENTERPRISE RESOURCE PLANNING IN INTEGRATED CIRCUIT FIRMS.

Integrated circuit-packet switching NoC with efficient circuit setup mechanism.

An integrated circuit of a universal comparator.

Parametric yield optimization with mesh adaptive direct search.

Process Optimization for 3-D IC Assembly.

KL_GA: an application mapping algorithm for mesh-of-tree (MoT) architecture in network-on-chip design.

A CASE STUDY OF ENCAPSULATED IC ACCELERATED FAILURE DUE TO THE KIRKENDALL EFFECT ON DOWNHOLE CIRCUITS.

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