نتائج البحث

Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives.

• Authors : Durairaj, R.¹ ; Mallik, S.² ; Seman, A.²

• Source: Sādhanā: Academy Proceedings in Engineering Sciences. Oct2009, Vol. 34 Issue 5, p799-810. 12p. 1 Diagram, 3 Charts, 3 Graphs.

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Integrating copper at the nanometer length scale with Sn-3⋅5Ag solder to develop high performance nanocomposites.

• Authors : Babaghorbani, P.¹; Nai, S. M. L.²; Gupta, M.¹

• Source: Materials Science & Technology. Oct2009, Vol. 25 Issue 10, p1258-1264. 7p. 5 Diagrams, 2 Charts, 3 Graphs.

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Constitutive models of creep for lead-free solders.

• Authors : Ma, Hongtao¹

• Source: Journal of Materials Science. Jul2009, Vol. 44 Issue 14, p3841-3851. 11p. 1 Color Photograph, 2 Diagrams, 2 Charts, 21 Graphs.

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Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn–xAg–0·5Cu (x: 1, 3 and 4 mass-%) lead free solders.

• Authors : Terashima, S.¹ ; Tanaka, M.¹

• Source: Science & Technology of Welding & Joining. Jul2009, Vol. 14 Issue 5, p767-774. 8p. 5 Diagrams, 1 Chart, 8 Graphs.

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Lead-free RoHS on military electronics procurement.

• Authors : Wilson, J. R.

• Source: Military & Aerospace Electronics. Apr2009, Vol. 20 Issue 4, p24-29. 6p.

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NEW PRODUCTS.

• Source: Military & Aerospace Electronics. Jun2009, Vol. 20 Issue 6, p40-42. 3p.

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CAREER PROFILE: Iver E. Anderson.

• Source: Machine Design. 2/19/2009, Vol. 81 Issue 4, p42-43. 2p. 1 Color Photograph.

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Stubble Trouble--Beating Back Those Tin Whiskers.

• Authors : Whytock, Paul

• Source: Electronic Design. 10/1/2009, Vol. 57 Issue 20, p38-38. 1p. 2 Black and White Photographs.

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Air Products Signs Two Contracts with Nokia in China to Supply Nitrogen.

• Source: China Chemical Reporter. 1/6/2009, Vol. 20 Issue 1, p9-9. 1/6p.

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