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IC and Package Co-design.

• Authors : Maxwell-Davis, Darren¹; Sovinsky, John²; Escobar, Curtis³

• Source: Advanced Packaging. May/Jun2006, Vol. 15 Issue 5, p32-43. 3p.

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TURTLE-P: a UML profile for the formal validation of critical and distributed systems.

• Authors : Apvrille, Ludovic¹ ; De Saqui-Sannes, Pierre² ; Khendek, Ferhat³

• Source: Software & Systems Modeling. Dec2006, Vol. 5 Issue 4, p449-466. 18p. 23 Diagrams, 1 Chart.

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Collaborative Learning, Benchmarking, and the Testing of Leadership Development Models Thrive Under LENS.

• Source: Modern Healthcare. 12/4/2006 Supplement, Vol. 36, p5-6. 2p. 1 Diagram, 1 Map.

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Is Gehry Radical or Hack?

• Source: American Theatre. Sep2006, Vol. 23 Issue 7, p13-13. 1/3p.

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System-In-Package IC Design Gets Lift From Tools And Methodology Kit.

• Authors : Maliniak, David

• Source: Electronic Design. 8/3/2006, Vol. 54 Issue 17, p30-30. 1/3p.

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INSIGHTS FROM MEPTEC.

• Authors : Goldstein, Julia

• Source: Advanced Packaging. Jan2006, Vol. 15 Issue 1, p8-10. 2p.

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HIGHER-DIMENSIONAL PACKING WITH ORDER CONSTRAINTS.

• Authors : Fekete, Sándor P.¹ ; Köhler, Ekkehard² ; Teich, Jürgen³

• Source: SIAM Journal on Discrete Mathematics. 2006, Vol. 20 Issue 4, p1056-1078. 23p. 13 Diagrams, 5 Charts, 1 Graph.

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Don't Do It Yourself.

• Authors : Parker, Bo¹

• Source: Inc.. Aug2006, Vol. 28 Issue 8, p20-20. 1/4p.

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