نتائج البحث

Northrop Grumman invites UK firms to discuss future UAV deals.

• Source: Professional Engineering. 11/5/2003, Vol. 16 Issue 19, p7-7. 1/3p. 1 Color Photograph.

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Enterprise Resource Planning for Construction Business Management.

• Authors : Shi, Jonathan Jingsheng; Halpin, Daniel W.

• Source: Journal of Construction Engineering & Management. Mar/Apr2003, Vol. 129 Issue 2, p214. 8p.

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Cement Manufacture and the Environment, Part II: Environmental Challenges and Opportunities.

• Authors : van Oss, Hendrik G.; Padovani, Amy C.

• Source: Journal of Industrial Ecology. Winter2003, Vol. 7 Issue 1, p93-126. 34p. 1 Diagram, 3 Charts, 1 Map.

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FLUID COMPONENTS TO TARGET SEMICONDUCTOR MANUFACTURING INDUSTRY.

• Authors : Higgins, Amy; Koucky, Sherri

• Source: Machine Design. 5/22/2003, Vol. 75 Issue 10, p26. 1/6p. 1 Color Photograph.

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SWARM STUPIDITY.

• Authors : Fox, Stephen

• Source: Manufacturing Engineer. Dec2003/Jan2004, Vol. 82 Issue 6, p26-29. 4p.

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A holistic approach to Overall Equipment Effectiveness (OEE).

• Authors : Loughlin, Shane¹

• Source: Computing & Control Engineering. Dec2003/Jan2004, Vol. 14 Issue 6, p37-42. 6p.

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Global manufacturing and innovation a supply chain perspective.

• Authors : Cox, Steve¹

• Source: Computing & Control Engineering. Dec2003/Jan2004, Vol. 14 Issue 6, p31-36. 6p.

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User-defined annotations: artefacts for co-ordination and shared understanding in design teams.

• Authors : Boujut, Jean-François¹ (AUTHOR)

• Source: Journal of Engineering Design. Dec2003, Vol. 14 Issue 4, p409-419. 11p.

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A simulated annealing algorithm for integration of shop floor control strategies in semiconductor wafer fabrication.

• Authors : Sha, D. Y.¹ ; Chao-Yang Liu¹

• Source: International Journal of Advanced Manufacturing Technology. Sep2003, Vol. 22 Issue 1/2, p75-88. 14p.

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Recognition of texture types of wear particles.

• Authors : Laghari, M. S.

• Source: Neural Computing & Applications. 2003, Vol. 12 Issue 1, p18-25. 8p.

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