نتائج البحث

Ultrasonic characterization of the interface between a die attach adhesive and a copper leadframe in IC packaging.

• Authors : Guo, N.; Abdul, J.; Wong, B. S.

• Source: Journal of Adhesion Science & Technology. 9/1/2002, Vol. 16 Issue 9, p1261-1279. 19p.

تفاصيل العنوان

Die Products: Ideal IC Packaging For Demanding Applications.

• Authors : Gilg, Larry; Windsor, Chris

• Source: Electronic Design. 12/23/2002, Vol. 50 Issue 27, p47. 4p. 4 Color Photographs, 1 Diagram, 1 Chart.

تفاصيل العنوان

Heat Resistant Underfill for Flip-chip Packaging.

• Authors : Wonho Kim¹; Jong-Woo Bae, D.¹

• Source: Molecular Crystals & Liquid Crystals Science & Technology, Section A: Molecular Crystals & Liquid Crystals. 2002, Vol. 374 Issue 1, p409-414. 6p.

تفاصيل العنوان

new products.

• Source: Electronic Design. 4/1/2002, Vol. 50 Issue 7, p63. 4p.

تفاصيل العنوان

Micro- and Nanoscale Heat Transfer: Challenges and Opportunities.

• Authors : Darabi, Jeff

• Source: Heat Transfer Engineering. Mar/Apr2002, Vol. 23 Issue 2, p1-2. 2p.

تفاصيل العنوان

Transformer Technology License Will Spur New Applications.

• Authors : Morrison, David G.

• Source: Electronic Design. 5/27/2002, Vol. 50 Issue 11, p40. 2/3p.

تفاصيل العنوان

section notes.

• Source: American Ceramic Society Bulletin. May2002, Vol. 81 Issue 5, p58. 1p.

تفاصيل العنوان