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我国集成电路现代化产业体系构建的 战略与路径思考.

• Authors : 尹西明¹; 张贝贝²; 陈泰伦³

• Source: Bulletin of the Chinese Academy of Sciences / Chung-kuo ko Hsueh Yuan Yuan Kan. 2024, Vol. 39 Issue 7, p1191-1204. 14p.

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3D-ACC：基于3D集成电路的卷积神经网络加速结构研究.

• Authors : 王吉军¹ ; 郝子宇¹; 李宏亮¹

• Source: Application Research of Computers / Jisuanji Yingyong Yanjiu. Dec2020, Vol. 37 Issue 12, p3671-3680. 7p.

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Development of High-purity Metal Sputtering Targets for Integrated Circuits

• Authors : He Jinjiang; Lyu Baoguo; Jia Qian

Subjects: high-purity metal; sputtering target; integrated circuit

• Source: 中国工程科学, Vol 25, Iss 1, Pp 79-87 (2023)

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微芯片技术在油气田井下漏层定位中的应用.

• Authors : 苗海龙^1,2 ; 马跃²; 石钊睿³

• Source: Chemical Engineering of Oil & Gas / Shi You Yu Tian Ran Qi Hua Gong. 2024, Vol. 53 Issue 1, p77-82. 6p.

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The study on layout comparability model of integrated circuits

• Authors : Ding Ke; Zhang Jun; Jiang Weijun

Subjects: integrated circuits; layout design; originality

• Source: Dianzi Jishu Yingyong, Vol 45, Iss 10, Pp 45-49 (2019)

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基于AES算法的 eFlash 控制器安全设计.

• Authors : 林宇红¹; 肖昊¹

• Source: Electronic Science & Technology. 2023, Vol. 36 Issue 10, p62-67. 6p.

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Development and application of a radiation effect evaluation method of aerospace integrated circuits for radiation hardened by design

• Authors : ZHENG Hongchao; WANG Liang; LI Zhe

Subjects: aerospace integrated circuit; single-event effect; radiation hardened by design

• Source: He jishu, Vol 46, Iss 8, Pp 080007-080007 (2023)

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基于通道差值模型的导向滤波去雾算法及其 FPGA 实现.

• Authors : 曹红芳¹; 王晓蕾¹; 杜高明¹

• Source: Electronic Science & Technology. 2023, Vol. 36 Issue 8, p1-6. 6p.

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热屏结构对 200 mm 半导体级提拉单晶硅中 氧含量分布的影响.

• Authors : 芮　阳¹ ; 王忠保¹; 盛　旺²

• Source: Journal of Synthetic Crystals. Jun2023, Vol. 52 Issue 6, p1110-1119. 10p.

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硅基毫米波收发前端集成电路研究进展.

• Authors : 邱枫^1,2 ; 宛操^1,2; 罗雄耀^1,2

• Source: Journal of Nanjing University of Information Science & Technology (Natural Science Edition) / Nanjing Xinxi Gongcheng Daxue Xuebao (ziran kexue ban). 2021, Vol. 13 Issue 4, p383-396. 14p.

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