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Wafer-Level Vacuum Packaging of Smart Sensors.

• Authors : Hilton A; Electronics and Applied Physics Division, RTI International, Research Triangle Park, NC 27709, USA. .; Temple DS

• Source: Sensors (Basel, Switzerland) [Sensors (Basel)] 2016 Oct 31; Vol. 16 (11). Date of Electronic Publication: 2016 Oct 31.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220

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