نتائج البحث

Participation pathways for women into university makerspaces.

• Authors : Tomko, Megan¹ (AUTHOR) ; Alemán, Melissa W.² (AUTHOR) ; Newstetter, Wendy³ (AUTHOR)

• Source: Journal of Engineering Education. Jul2021, Vol. 110 Issue 3, p700-717. 18p.

تفاصيل العنوان

Participation Pathways for Women into University Makerspaces

• Authors : Tomko, Megan (ORCID 0000-0003-0276-2140); Alemán, Melissa W. (ORCID 0000-0002-1979-6964); Newstetter, Wendy (ORCID 0000-0001-5693-4265)

Subjects: Student Participation; Females; College Students

• Source: Journal of Engineering Education. Jul 2021 110(3):700-717.18

تفاصيل العنوان

An Assessment Instrument of Technological Literacies in Makerspaces and FabLabs

• Authors : Blikstein, Paulo; Kabayadondo, Zaza; Martin, Andrew

Subjects: Technological Literacy; Engineering Education; Skill Development

• Source: Journal of Engineering Education. Jan 2017 106(1):149-175.27

تفاصيل العنوان

An Assessment Instrument of Technological Literacies in Makerspaces and FabLabs.

• Authors : Blikstein, Paulo¹ ; Kabayadondo, Zaza² ; Martin, Andrew¹

• Source: Journal of Engineering Education. Jan2017, Vol. 106 Issue 1, p149-175. 27p.

تفاصيل العنوان

Participation pathways for women into university makerspaces

• Authors : Megan Tomko; Wendy C. Newstetter; Melissa Wood Aleman

Subjects: Medical education; Community of practice; Engineering education

• Source: Journal of Engineering Education. 110:700-717

تفاصيل العنوان

Exploring scenario‐based assessment of students' global engineering competency: Building evidence of validity of a China‐based situational judgment test.

• Authors : Davis, Kirsten A.¹, ; Jesiek, Brent K.¹, ; Knight, David B.²,

• Source: Journal of Engineering Education; Oct2023, Vol. 112 Issue 4, p1032-1055, 24p

تفاصيل العنوان

Inequity in graduate engineering identity: Disciplinary differences and opportunity structures.

• Authors : Bahnson, Matthew¹, ; Perkins, Heather², ; Tsugawa, Marissa^3,4,

• Source: Journal of Engineering Education; Oct2021, Vol. 110 Issue 4, p949-976, 28p

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