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INTELLECTUAL PROPERTY PROTECTION FOR INTEGRATED CIRCUITS.

• Authors : Konstantinov, Iskren

• Source: Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika; 2024 Spl Issue, Vol. 32, p173-183, 11p

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INTELLECTUAL PROPERTY AND SECURITY IN THE INTEGRATED CIRCUITS INDUSTRY.

• Authors : Nachev, Ivan; Tomova, Yuliana; Konstantinov, Iskren

• Source: Strategies for Policy in Science & Education / Strategii na Obrazovatelnata i Nauchnata Politika; 2024 Spl Issue, Vol. 32, p71-86, 16p

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Design, Analysis and Validation of MCP Package for GaAs Monolithic Microwave Integrated Circuits Packaging

• Authors : Gugulothu, Ravi; Bhalke, Sangam; K, Lalkishore

• Source: IETE Journal of Research; November 2023, Vol. 69 Issue: 11 p8293-8306, 14p

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Dry Etching of GaAs to Fabricate Via-Hole Grounds in Monolithic Microwave Integrated Circuits.

• Authors : Rawal, D. S.; Agarwal, V. R.; Sharma, H. S.

Subjects: INTEGRATED circuits; EMITTER-coupled logic circuits; ETCHING

• Source: Defence Science Journal; 2009, Vol. 59 Issue 4, p363-370, 8p

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Design Planning with 3D-Via Optimization in Alternative Stacking Integrated Circuits.

• Authors : CHAO-HUNG LU; HUNG-MING CHEN; LIU, CHIEN-NAN JIMMY

Subjects: INTEGRATED circuit design; MATHEMATICAL optimization; TRANSISTORS

• Source: Journal of Information Science & Engineering; Jan2011, Vol. 27 Issue 1, p287-302, 16p, 11 Diagrams, 3 Charts

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Physics of failure‐based failure mode, effects, and criticality analysis for Integrated Circuits

• Authors : Qiu, Wenhao; Lian, Guangyao; Xue, Mingxi

• Source: Systems Engineering; November 2018, Vol. 21 Issue: 6 p511-519, 9p

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EARLY CONCEPT FOR A GENERIC AND DOMAIN AGNOSTIC SERIOUS GAME FRAMEWORK.

• Authors : Atorf, Daniel; Dyck, Sergius; Kannegieser, Ehm

Subjects: MOBILE apps; ELECTRONIC circuits; INTEGRATED circuits

• Source: Proceedings of the IADIS International Conference on Cognition & Exploratory Learning in Digital Age; 2023, p439-442, 4p

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MOBILE SYSTEM FOR SIMULATION OF PHYSICAL CIRCUIT OPERATION AND APPLICATION TO EDUCATION INVOLVING CIRCUIT CONSTRUCTION.

• Authors : Atsushi Takemura

Subjects: MOBILE apps; ELECTRONIC circuits; INTEGRATED circuits

• Source: Proceedings of the IADIS International Conference on Cognition & Exploratory Learning in Digital Age; 2023, p433-438, 6p

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From Lab to Fab: UMass Amherst Awarded $7.9 Million to Build Al Hardware.

Subjects: COMMUNITY college curriculum; INTEGRATED circuits; SEMICONDUCTOR technologyUNIVERSITY of Massachusetts at Amherst; COMMONWEALTH of Nations

• Source: BusinessWest; 10/14/2024, Vol. 41 Issue 12, p34-35, 2p

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Using Artificial Intelligence in IC Substrate Production Predicting.

• Authors : ZHIFANG LIU

Subjects: ARTIFICIAL intelligence; PREDICTION models; INDUSTRIAL capacity

• Source: Journal of Information Science & Engineering; May2023, Vol. 39 Issue 3, p637-654, 18p

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