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Authors :
Kim D; Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science & Technology (DGIST), Daegu, 42988, South Korea.; Jeong H
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Source:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2024 Jul; Vol. 11 (28), pp. e2401250. Date of Electronic Publication: 2024 May 13.Publisher: WILEY-VCH Country of Publication: Germany NLM ID: 101664569 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2198-3844
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Authors :
Huang JH; Department of Materials Science and Engineering, National Taiwan University, Taipei 106, Taiwan.; Shih PS
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Source:
Materials (Basel, Switzerland) [Materials (Basel)] 2024 Apr 03; Vol. 17 (7). Date of Electronic Publication: 2024 Apr 03.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101555929 Publication Model: Electronic Cited Medium: Print ISSN: 1996-1944 (Print)
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Authors :
Han JK; School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), 291 Daehak-ro, Yuseong-gu, Daejeon, 34141, Republic of Korea.; Lee JW
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Source:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2023 Oct; Vol. 10 (30), pp. e2302380. Date of Electronic Publication: 2023 Sep 15.Publisher: WILEY-VCH Country of Publication: Germany NLM ID: 101664569 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 2198-3844
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Authors :
Miketic I; Department of Electrical and Computer Engineering, Stony Brook University, Stony Brook, NY 11794, USA.; Dhananjay K
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Source:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2023 Feb 13; Vol. 23 (4). Date of Electronic Publication: 2023 Feb 13.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220
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Authors :
Kung PY; Department of Materials Science and Engineering, National Taiwan University, Taipei 10617, Taiwan.; Huang WL
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Source:
Materials (Basel, Switzerland) [Materials (Basel)] 2022 Nov 04; Vol. 15 (21). Date of Electronic Publication: 2022 Nov 04.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101555929 Publication Model: Electronic Cited Medium: Print ISSN: 1996-1944 (Print)
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Authors :
Meng Y; High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China.; School of Integrated Circuits, University of Chinese Academy of Sciences, Beijing 100049, China.
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Source:
Materials (Basel, Switzerland) [Materials (Basel)] 2022 Mar 30; Vol. 15 (7). Date of Electronic Publication: 2022 Mar 30.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101555929 Publication Model: Electronic Cited Medium: Print ISSN: 1996-1944 (Print)
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Authors :
Li K; Shanghai Institute of Applied Physics, Chinese Academy of Sciences, Shanghai 201800, People's Republic of China.; Deng B
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Source:
Journal of synchrotron radiation [J Synchrotron Radiat] 2020 Jul 01; Vol. 27 (Pt 4), pp. 1023-1032. Date of Electronic Publication: 2020 May 27.Publisher: Wiley Online Library Country of Publication: United States NLM ID: 9888878 Publication Model: Print-Electronic Cited Medium: Internet
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Authors :
Padmanabhan P; AQUA Laboratory, École Polytechnique Fédérale de Lausanne (EPFL), 2000 Neuchâtel, Switzerland. .; Hancock B
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Source:
Sensors (Basel, Switzerland) [Sensors (Basel)] 2018 Feb 03; Vol. 18 (2). Date of Electronic Publication: 2018 Feb 03.Publisher: MDPI Country of Publication: Switzerland NLM ID: 101204366 Publication Model: Electronic Cited Medium: Internet ISSN: 1424-8220
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Authors :
Kwon J; Department of Creative IT Engineering Pohang University of Science and Technology (POSTECH) 77 Cheongam-Ro Nam-Gu, Pohang Gyeongbuk 790-784 South Korea.; Kyung S
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Source:
Advanced science (Weinheim, Baden-Wurttemberg, Germany) [Adv Sci (Weinh)] 2016 Feb 19; Vol. 3 (5), pp. 1500439. Date of Electronic Publication: 2016 Feb 19 (Print Publication: Publisher: WILEY-VCH Country of Publication: Germany NLM ID: 101664569 Publication Model: eCollection Cited Medium: Print ISSN: 2198-3844 (Print)
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Authors :
Laloum D; University Grenoble Alpes, Grenoble, France; CEA, LETI, MINATEC Campus, Grenoble, Cedex 9, France
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Source:
Journal of microscopy [J Microsc] 2014 Nov; Vol. 256 (2), pp. 90-9. Date of Electronic Publication: 2014 Aug 05.Publisher: Published for the Royal Microscopical Society by Blackwell Scientific Publications Country of Publication: England NLM ID: 0204522 Publication Model:
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