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Academic Journal

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Subjects: [PHYS.MECA.MEMA]Physics [physics]/Mechanics [physics]/Mechanics of materials [physics.class-ph]

  • Source: ISSN: 2261-236X ; MATEC Web of Conferences ; https://hal.science/hal-03589929 ; MATEC Web of Conferences, 2023, 12, pp.04026. ⟨10.1051/matecconf/20141204026⟩.

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Academic Journal

Effects of voids on thermal-mechanical reliability of lead-free solder joints

Subjects: [PHYS.MECA.MEMA]Physics [physics]/Mechanics [physics]/Mechanics of materials [physics.class-ph]

  • Source: ISSN: 2261-236X ; MATEC Web of Conferences ; https://hal.science/hal-03589929 ; MATEC Web of Conferences, 2023, 12, pp.04026. ⟨10.1051/matecconf/20141204026⟩.

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