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Conference

Assessment of contribution of EHD to the cooling of power semiconductor devices immersed in dielectric liquids

Subjects: heat transfer; power modules; high voltageMA; United States

  • Source: 22nd IEEE International Conference on Dielectric Liquids (ICDL 2023)https://hal.science/hal-0415929322nd IEEE International Conference on Dielectric Liquids (ICDL 2023), Jun 2023,

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Academic Journal

Landauer vs. Nernst: What is the True Cost of Cooling a Quantum System?

Subjects: Thermodynamics; Quantum thermodynamics; Landauer's principle

  • Source: EISSN: 2691-3399 ; PRX Quantum ; https://hal.univ-grenoble-alpes.fr/hal-04082955 ; PRX Quantum, 2023, 4, pp.010332. ⟨10.1103/PRXQuantum.4.010332⟩

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Conference

Test bench for the characterization of two-phase passive immersion cooling of power electronic devices

Subjects: [SPI]Engineering Sciences [physics]Dusseldorf; Germany

  • Source: Conference on Integrated Power Electronics Systems (CIPS) ; https://hal.science/hal-04510812 ; Conference on Integrated Power Electronics Systems (CIPS), Mar 2024, Dusseldorf, Germany

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Academic Journal

Metal-as-Insulation REBCO Insert: Simplified Protection Scheme and Investigation of Cooling Defect Under High-Field Operation

Subjects: Helium bubble; HTS insert; Metal-as-insulation

  • Source: ISSN: 1051-8223 ; IEEE Transactions on Applied Superconductivity ; https://hal.science/hal-04416168 ; IEEE Transactions on Applied Superconductivity, 2024, 34 (5), pp.1-5, 4702405.

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