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Conference

Eletrical performance of self-assembly applied to die-to-wafer hybrid bonding

Subjects: 3D Integration; die-to-wafer; hybrid bondingBerlin; Germany

  • Source: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)IEEE ESTC 2024 - The 10th IEEE Electronics System-Integration Technology Conference

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Conference

Die-to-Wafer Hybrid Bonding Impact at MM-Wave Frequencies

Subjects: BiCMOS technology; compactness; direct hybrid bondingSendai; Japan

  • Source: International 3D Systems Integration Conference (3DIC 2024) ; https://hal.science/hal-04919954 ; International 3D Systems Integration Conference (3DIC 2024), Sep 2024, Sendai, Japan.

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Conference

Energy performance and environmental impact of solar photovoltaic, thermal and hybrid PVT panels in an individual house

Subjects: Photovoltaic; solar thermal; hybrid PVTLimassol; Cyprus

  • Source: Eurosun 2024 proceedings ; EuroSun 2024 - 15th International Conference on Solar Energy for Buildings and Industry ; https://cea.hal.science/cea-04985493 ; EuroSun 2024 - 15th International Conference

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Academic Journal

Structural, optical, and electronic properties of single crystals of 4H lead-based hexagonal hybrid perovskite

Subjects: Single crystal materials; Hybrid perovskites; Thermal conductivity

  • Source: ISSN: 2475-9953 ; Physical Review Materials ; https://hal.science/hal-04485212 ; Physical Review Materials, 2024, 8 (2), pp.025403. ⟨10.1103/PhysRevMaterials.8.025403⟩.

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Conference

Normalized benchmarking of hybrid switched-capacitor DC-DC converters

Subjects: DC-DC converter; hybrid converter topology; switching convertersAnn Arbor; United States

  • Source: COMPEL 2023 - IEEE 24th Workshop on Control and Modeling for Power Electronics ; https://cea.hal.science/cea-04523493 ; COMPEL 2023 - IEEE 24th Workshop on Control and Modeling for Power Electronics,

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