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Conference

SiC lateral Schottky diode technology for integrated smart power converter

Subjects: electrical characteristics; SiC; power converterLyon; France

  • Source: Proceedings of the 2018 IEEE International Conference on Industrial Technology ; 2018 IEEE ICIT ; https://hal.science/hal-01864545 ; 2018 IEEE ICIT, Feb 2018, Lyon, France.

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Academic Journal

A Comparative Study: Dynamic and Thermal Behavior of Nanocrystalline and Powder Magnetic Materials in a Power Converter Application

Subjects: Magnetic losses; Nanocrystalline and Powder Materials; Thermal behavior

  • Source: Journal of Optoelectronics and Advanced Materials ; https://hal.science/hal-01188828 ; Journal of Optoelectronics and Advanced Materials, 2015, 44 (10), pp.3768-3776. ⟨10.1007/s11664-015-3846-x⟩

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Academic Journal

Thermal Considerations of a Power Converter with Components Embedded in Printed Circuit Boards

Subjects: [SPI.TRON]Engineering Sciences [physics]/Electronics; [SPI.NRJ]Engineering Sciences [physics]/Electric power

  • Source: ISSN: 2156-3950 ; IEEE Transactions on Components, Packaging and Manufacturing Technology ; https://hal.science/hal-02291493 ; IEEE Transactions on Components, Packaging and Manufacturing

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Conference

Analytical model for SiC based power converter optimization including EMC and thermal constraints

Subjects: WBG semi-conductors; optimization; thermalAngers; France

  • Source: Proceedings of the 2017 IEEE International Symposium on Electromagnetic Compatibility ; 2017 International Symposium on Electromagnetic Compatibility (EMC EUROPE) ; https://hal.science/hal-01736156 ;

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Academic Journal

SiC integrated circuits for smart power converter

Subjects: SiC; Integrated circuits; MESFET

  • Source: ISSN: 1453-8245 ; Romanian Journal of Information Science and Technology ; https://hal.science/hal-04277111 ; Romanian Journal of Information Science and Technology, 2017, 20 (4), pp.385-399.

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Academic Journal

N-Conductor Passive Circuit Modeling for Power Converter Current Prediction and EMI aspect

Subjects: current prediction; Impedance matrix; Passive circuit modeling

  • Source: ISSN: 0018-9375 ; IEEE Transactions on Electromagnetic Compatibility ; https://hal.science/hal-01103586 ; IEEE Transactions on Electromagnetic Compatibility, 2013, 55 (6), pp.1169-1177.

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