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Conference

Usage Of Solders With Higher Melting Point For Hybrid Integrated Circuits

Subjects: Brazing; thick film; leaching

  • Source: Proceedings of the 24th Conference STUDENT EEICT 2018. s. 79-81. ISBN 978-80-214-5614-3

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Conference

Saving area and power consumption in 65 nm digital standard cell library

Subjects: digital standard library; integrated circuits; chip development

  • Source: Proceedings I of the 28st Conference STUDENT EEICT 2022: General papers. s. 190-193. ISBN 978-80-214-6029-4

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  • 1-10 ل  48 نتائج ل ""Integrated circuits""