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  • 1-2 of  2 نتائج ل ""Girard, Patrick""

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Collection : Archive Ouverte Hal (Hyper Article En Ligne, Ccsd - Centre Pour La Communication Scientifique Directe) Publisher : ieee Subject : through-silicon vias
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Conference

TSV aware timing analysis and diagnosis in paths with multiple TSVs

Subjects: Integrated circuit testing; 3D integration; Through-Silicon vias (TSV)Napa; CA; United States

  • Source: 32nd VLSI Test SymposiumVTS: VLSI Test Symposiumhttps://hal-lirmm.ccsd.cnrs.fr/lirmm-01248594VTS: VLSI Test Symposium, Apr 2014, Napa, CA, United States.

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Academic Journal

A Study of Tapered 3-D TSVs for Power and Thermal Integrity

Subjects: Analytical models; Switching circuits; Through-silicon vias

  • Source: ISSN: 1063-8210 ; IEEE Transactions on Very Large Scale Integration (VLSI) Systems ; https://hal-lirmm.ccsd.cnrs.fr/lirmm-00806776 ;

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  • 1-2 of  2 نتائج ل ""Girard, Patrick""