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Sticking-it to tough thermal-management challenges: Aerospace and defense specialists are formulating a new generation of electronics adhesives and encapsulants that can stand-up to the heat of hypersonics and space.

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  • المؤلفون: Whitney, Jamie
  • المصدر:
    Military & Aerospace Electronics. Sep2023, Vol. 34 Issue 8, p20-25. 5p.