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Sticking-it to tough thermal-management challenges: Aerospace and defense specialists are formulating a new generation of electronics adhesives and encapsulants that can stand-up to the heat of hypersonics and space.
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- المؤلفون: Whitney, Jamie
- المصدر:
Military & Aerospace Electronics. Sep2023, Vol. 34 Issue 8, p20-25. 5p.
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