All solution-process and product for transparent conducting film

10669,636

15/455762

March 10, 2017

An all solution-processed deposition includes a non-water soluble, non-self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), a water soluble, self-cracking film deposited by a solution process (e.g., spray, dip, spin coat, and the like), cracking of the film, and filling the cracks with a metal that is deposited in solution (e.g., by electroless disposition). A transparent substrate having a cracked water insoluble, non-self-cracking film surface coating includes a plurality of fissures therein extending to and exposing portions of the surface of the underlying transparent substrate is useful for producing a transparent conducting film.

Naughton, Michael J. (Chestnut Hill, MA, US); Yang, Chaobin (Brighton, MA, US); Kempa, Kris (Chestnut Hill, MA, US); Burns, Michael J. (Bedford, MA, US)

The Trustees of Boston College (Chestnut Hill, MA, US)

1. A process for producing a transparent conducting film, comprising: depositing a first solution on a surface of a substrate; solidifying the first solution to form a water insoluble, non-self-cracking film on the surface of the substrate; depositing a second solution on the water insoluble, non-self-cracking film; solidifying the second solution to form a water soluble, self-cracking film on the water insoluble, non-self-cracking film, wherein the water soluble, self-cracking film cracks to provide a plurality of fissures therein exposing portions of the underlying water insoluble, non-self-cracking film; illuminating with UV light the exposed portions of the water insoluble, non-self-cracking film; removing the UV illuminated portions of the water insoluble, non-self-cracking film exposing the underlying surface of the substrate in the fissures; applying a third solution comprising a metal on the exposed underlying surface of the substrate which deposits the metal on the underlying surface of the substrate forming a connected metal network directly on the substrate; and removing the water insoluble, non-self-cracking film from the substrate yielding a transparent conducting film comprising the connected metal network.

2. The process of claim 1 , wherein the first solution comprises a solution of a thermopolymer or photopolymer.

3. The process of claim 2 , wherein the solution of a photopolymer comprises a photoresist.

4. The process of claim 1 , wherein the water insoluble, non-self-cracking film comprises a photoresist.

5. The process of claim 1 , wherein solidifying the first solution comprises heating or drying without heat.

6. The process of claim 1 , wherein the first solution is deposited by a spray, dip, or spin coat process.

7. The process of claim 1 , wherein the second solution comprises a solution of egg white and water, chicken collagen and water, TiO 2 and water, or a water-based nail polish.

8. The process of claim 1 , wherein solidifying the second solution comprises heating or drying without heat.

9. The process of claim 1 , wherein the water soluble, self-cracking film comprises polymerized egg white, polymerized chicken collagen, TiO 2 or polymerized nail polish.

10. The process of claim 1 , wherein the second solution is deposited by a spray, dip, or spin coat process.

11. The process of claim 1 , wherein the third solution comprises an electroless plating solution.

12. The process of claim 11 , wherein the electroless plating solution comprises silver, copper, or zinc.

13. The process of claim 1 , wherein the substrate comprises a transparent substrate.

14. The process of claim 13 , wherein the transparent substrate comprises glass or a transparent polymer.

15. The process of claim 14 , wherein the transparent polymer comprises polyethylene terephthalate, polyethylene naphthalate, mylar, poly(bis(cyclopentadiene)) condensate material, and colorless polyimide.

7172822 February 2007 Shibata
2014/0326697 November 2014 Carnahan et al.

Mastropietro, Mike; “Overview of transparent metal mesh electrode technologies;” 2015 DOE Solid-State Lighting R&D Workshop; Jan. 27-20, 2015; San Francisco, CA. cited by applicant
Kim, Won-Kyung et al., “Cu mesh for flexible transparent conductive electrodes,” Scientific Reports, Jun. 3, 2015, vol. 5, pp. 10715-10722. cited by applicant
Fenn, John, “Other TCF materials,” Fennagain, Nov. 2014, https://fennagain.wordpress.com/2014/11. cited by applicant
Li, Yaowen et al., “ITO-free photovoltaic cell utilizing a high-resolution silver grid current collecting layer,” Solar Energy Materials & Solar Cells, available online Mar. 1, 2013, vol. 113, pp. 85-89, doi:10.1016/j.solmat.2013.01.043. cited by applicant
Han, Bing, et al., “Uniform solf-forming metallic network as a high-performance transparent conductive electrode,” Advanced Materials, 2014, vol. 26, pp. 873-877, doi:10.1002/adma.201302950. cited by applicant
Rolith, Inc., “NanoWeb: submicron-transparent metal mesh conductors,” accessed Mar. 9, 2016, www.rolith.com/applications/transparent-conductive-electrodes. cited by applicant
Fenn, John, “Other transparent conductive thin film candidates for use in touch panels,” Fennagain, Aug. 26, 2014, https://fennagain.wordpress.com/2014/08/26/other-transparent-conductive-thin-film-candidates-for-use-in-touch-panels. cited by applicant

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