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PHOTONIC CHIP COUPLER CONNECTOR MODULE

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  • Publication Date:
    November 7, 2024
  • معلومة اضافية
    • Document Number:
      20240372631
    • Appl. No:
      18/774969
    • Application Filed:
      July 17, 2024
    • نبذة مختصرة :
      An optical interconnect module for coupling a photonic integrated chip to an optical ferrule is provided. The optical interconnect module may include a coupler for interfacing to the photonic integrated chip, the coupler comprising at least one guide pin. The optical interconnect module may include an optical ferrule configured for being removably attached to the coupler, the optical ferrule comprising at least one through hole for receiving the at least one guide pin from the coupler.
    • Claim:
      1. An optical interconnect module comprising: a coupler for interfacing to a photonic integrated chip, the coupler comprising at least one guide pin; and an optical ferrule configured for being removably attached to the coupler, the optical ferrule comprising at least one through hole for receiving the at least one guide pin from the coupler, wherein the coupler further comprises a lens plate extends downwardly from a bottom surface of the coupler and is configured to connect optical fibers and the photonic integrated chip.
    • Claim:
      2. The optical interconnect module of claim 1, wherein the coupler further comprises a waveguide structure, configured to direct multiple rows of optical fiber signals on to a single row of optical fiber signals through optical waveguide coupling.
    • Claim:
      3. The optical interconnect module of claim 1, wherein the optical ferrule further comprises a latching mechanism configured to grasp the coupler at a latching block for secure attachment.
    • Claim:
      4. The optical interconnect module of claim 1, wherein the optical ferrule further comprises a tensioning member configured to provide forward bias of a ribbon cable to the coupler.
    • Claim:
      5. The optical interconnect module of claim 1, wherein the at least one guide pin comprises at least two guide pins oriented on a first plane above a second plane that defines the orientation of the waveguides.
    • Claim:
      6. The optical interconnect module of claim 1, wherein the coupler comprises a visual surface indicator for automated alignment and placement of the coupler within the optical interconnect module.
    • Claim:
      7. The optical interconnect module of claim 1, wherein the coupler comprises waveguides preserving polarization of light beams.
    • Claim:
      8. The optical interconnect module of claim 1, wherein the photonic integrated chip comprises attachment points for connection to the coupler.
    • Claim:
      9. The optical interconnect module of claim 8, wherein the attachment points comprise at least one metallization point for solder joints, and the coupler comprises complementary points for soldering to the photonic integrated chip.
    • Claim:
      10. The optical interconnect module of claim 1, wherein the coupler further comprises metallization elements to enable hermetic sealing or electromagnetic interference control.
    • Claim:
      11. The optical interconnect module of claim 1, wherein the coupler is manufactured using a glass material.
    • Claim:
      12. The optical interconnect module of claim 1, wherein the coupler comprises a mating surface comprising fibers or lenses or optical waveguides mating to corresponding optical fibers or lenses from the optical ferrule.
    • Claim:
      13. The optical interconnect module of claim 1, wherein the coupler further comprises a photonic integrated chip-side facet for mating to corresponding waveguides, lenses, or other optical coupling means of the photonic integrated chip.
    • Claim:
      14. The optical interconnect module of claim 1, wherein the coupler further comprises optical fibers or waveguides, and the coupler further comprises means for matching photonic integrated chip-side optical waveguide mode fields to the coupler optical fibers or waveguides.
    • Claim:
      15. The optical interconnect module of claim 1, wherein the optical ferrule further comprises a plurality of fiber holes having fiber hole-to-fiber hole pitch between 100 micrometers to 250 micrometers, or fiber holes having outer diameters from 80 micrometers to 125 micrometers, or fiber holes having a total width of approximately 4 millimeters.
    • Claim:
      16. The optical interconnect module of claim 1, wherein the optical ferrule further comprises a latching hook configured to grasp the coupler at a latching block for secure attachment, and an internal spring to forwardly bias the optical fibers against the lens plate.
    • Claim:
      17. A method for assembling an optical interconnect module for coupling a photonic integrated chip to an optical ferrule, the method comprising: providing a coupler for the photonic integrated chip, the coupler comprising at least one guide pin; and attaching an optical ferrule comprising at least one through hole to the coupler by mating the at least one guide pin to the at least one through hole, the optical ferrule configured to be removably attached to the coupler, wherein the coupler further comprises a lens plate extends downwardly from a bottom surface of the coupler and is configured to connect optical fibers and the photonic integrated chip.
    • Claim:
      18. The method of claim 17, wherein the coupler further comprises a waveguide structure, configured to direct multiple rows of optical fiber signals on to a single row of optical fiber signals through optical waveguide coupling.
    • Claim:
      19. The method of claim 17, wherein the optical ferrule comprises a latching hook and an internal spring to forwardly bias the optical fibers against the lens plate, wherein the coupler comprises a latch block, and attaching the optical ferrule comprises latching the optical ferrule to the latch block on the coupler.
    • Claim:
      20. The method of claim 17, wherein the coupler comprises a visual surface indicator, and attaching the coupler comprises aligning and placing the coupler on a photonic integrated chip using the visual surface indicator.
    • Claim:
      21. The method of claim 20, wherein aligning and placing comprise machine vision recognizing the visual surface indicator and aligning based on the visual surface indicator.
    • Claim:
      22. The method of claim 17, wherein attaching the coupler comprises reflow soldering the coupler to the photonic integrated chip.
    • Claim:
      23. The method of claim 17, wherein the optical ferrule further comprises a fiber ribbon and a tensioning member, and attaching the optical ferrule to the coupler tensions the fiber ribbon against a mating surface of the coupler.
    • Current International Class:
      04; 02; 02
    • الرقم المعرف:
      edspap.20240372631