- Document Number:
20070001296
- Appl. No:
11/469307
- Application Filed:
August 31, 2006
- نبذة مختصرة :
A semiconductor package system is provided including forming a support platform, mounting a first device over the support platform, forming a bump on the support platform, and mounting a second device on the first device and the bump.
- Inventors:
Lee, Hun Teak (Singapore, SG); Kim, Jong Kook (Singapore, SG); Kim, ChulSik (Singapore, SG); Jang, Ki Youn (Singapore, SG); Kang, Keon Teak (Singapore, SG); Jeon, Hyung Jun (Singapore, SG)
- Assignees:
STATS CHIPPAC LTD. (Singapore, SG)
- Claim:
1. A semiconductor package system comprising: forming a support platform; mounting a first device over the support platform; forming a bump on the support platform; and mounting a second device on the first device and the bump.
- Claim:
2. The system as claimed in claim 1 wherein forming the bump includes forming a stud bump, a solder bump, or a stack with one or both with a conductive material.
- Claim:
3. The system as claimed in claim 1 wherein forming the support platform includes forming a substrate.
- Claim:
4. The system as claimed in claim 1 further comprising mounting a third device on the second device.
- Claim:
5. The system as claimed in claim 1 wherein forming the support platform includes: forming a third device having the bump thereon; and further comprising: forming a substrate; and mounting the third device over the substrate.
- Claim:
6. A semiconductor package system comprising: forming a support platform; mounting a first integrated circuit die over the support platform; forming a bump on the support platform; and mounting a second integrated circuit die on the first integrated circuit die and the bump.
- Claim:
7. The system as claimed in claim 6 wherein forming the support platform includes: forming a substrate; and further comprising: connecting the first integrated circuit die and the substrate; connecting the second integrated circuit die and the substrate; and molding the first integrated circuit die, the second integrated circuit die, the bump, and the substrate.
- Claim:
8. The system as claimed in claim 6 wherein forming the support platform includes: forming a third integrated circuit die having the bump thereon; and further comprising: forming a substrate; connecting the third integrated circuit die and the substrate; connecting the first integrated circuit die and the substrate; connecting the second integrated circuit die and the substrate; and molding the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the bump, and the substrate.
- Claim:
9. The system as claimed in claim 6 wherein: forming the support platform includes: forming a substrate having a support pad; and forming the bump on the support platform further includes: forming the bump on the support pad.
- Claim:
10. The system as claimed in claim 6 wherein: forming the support platform includes: forming a substrate having a support pad; and forming the bump on the support platform further includes: forming the bump on the support pad; and further comprising: connecting a voltage reference to the bump.
- Claim:
11. A semiconductor package system comprising: a support platform; a first device over the support platform; a bump on the support platform; and a second device on the first device and the bump.
- Claim:
12. The system as claimed in claim 11 wherein the bump is a stud bump, a solder bump, or a stack with one or both.
- Claim:
13. The system as claimed in claim 11 wherein the support platform is a substrate.
- Claim:
14. The system as claimed in claim 11 further comprising a third device on the second device.
- Claim:
15. The system as claimed in claim 11 wherein the support platform is a third device having the bump thereon and further comprising: a substrate having the third device thereover.
- Claim:
16. The system as claimed in claim 11 wherein: the support platform has a conductive structure; the first device is a first integrated circuit die over the support platform; the bump is next to the first device on the support platform; and the second device is a second integrated circuit die on the first device and the bump.
- Claim:
17. The system as claimed in claim 16 wherein the support platform is a substrate and further comprising: an interconnect between the first integrated circuit die and the substrate as well as between the second integrated circuit die and the substrate; and an encapsulation to cover the first integrated circuit die, the second integrated circuit die, the bump, and the substrate.
- Claim:
18. The system as claimed in claim 16 wherein the support platform is a third integrated circuit die and further comprising: a substrate with the third integrated circuit die thereon; an interconnect between the first integrated circuit die and the substrate as well as between the second integrated circuit die and the substrate; and an encapsulation to cover the first integrated circuit die, the second integrated circuit die, the third integrated circuit die, the bump, and the substrate.
- Claim:
19. The system as claimed in claim 16 wherein: the support platform is a substrate; and the bump on the support platform is on a support pad of the substrate.
- Claim:
20. The system as claimed in claim 16 wherein: the support platform is a substrate; and the bump on the support platform is on a support pad of the substrate for a connection to a voltage reference.
- Current U.S. Class:
257723/000
- Current International Class:
01
- الرقم المعرف:
edspap.20070001296
Processing Request
No Comments.