Investigation of phase-transformation kinetics in electrodeposited Cu + Cd alloys using anodic linear sweep voltammetry

Elsevier 1993

The anodic linear sweep voltammetry technique was used for a quantitative assessment of the phase composition of Cu + Cd alloys obtained by electrochemical deposition. Current peaks obtained in the voltammograms were attributed to the presence of particular intermetallic compounds known to exist in this system. It was found that alloys deposited by current densities exceeding the diffusion limiting current of Cu by several fold contain all the compounds recorded in the phase diagrams at an excess of pure Cd. The most dominant phase was found to be Cu5Cd8. It was observed that the voltammograms change with time, indicating that the freshly deposited alloys are unstable. Stabilization was found to take times in the range of 2 h. It is likely to occur in such a way that the excess Cd reacts with Cu-rich compounds to form CuCd3. The method was found to be very sensitive to the presence of any particular phase. Thus CuCd3, for example, could be detected at a level as low as 0.5%. The kinetics of the solid state reaction can be interpreted using the Johnson-Mehl equation. High values of the coefficient n indicate that nucleation of the new phase is a probable rate-determining step.

anodic linear sweep voltammetry; phase-transformation kinetics; alloys; Johnson-Mehl equation; article

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Journal of Electroanalytical Chemistry

RSPST oai:cer.ihtm.bg.ac.rs:123456789/6831
1572-6657
https://cer.ihtm.bg.ac.rs/handle/123456789/6831
10.1016/0022-0728(93)80185-K
2-s2.0-0001256568
1410096222

UIVERSITY OF BELGRADE
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