نبذة مختصرة : In order to solve the problem of solder balls being prone to oxidation during long-term storage and transportation, a novel water-based polymer surface treatment agent for solder balls was prepared and researched, with solder balls of Sn3.0Ag0.5Cu serving as the research object. The surface treatment agent was formulated with benzotriazole and polyvinyl alcohol 4000 as film-forming agents, using ascorbic acid as an antioxidant, and incorporating a small amount of alkaline complexing agents and surfactants. The solder balls, processed by this surface treatment agent, were characterized through an oxidation resistance test, shear strength test, cavity test, coating condition test and Raman spectroscopy. Results showed that after treatment with this surface agent, the shear strength of the solder joint of the solder ball increased by 48%; the cavity rate of the solder joint of the solder ball was less than 4%, meeting the industry requirements(less than 15%). These results indicated that the solder balls treated with this surface treatment agent formed a dense anti-oxidation film on their surface, improving the oxidation resistance of the solder balls.
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