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Development of a Low-Expansion and Low-Shrinkage Thermoset Injection Moulding Compound Tailored to Laminated Electrical Sheets

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  • معلومة اضافية
    • بيانات النشر:
      MDPI AG, 2024.
    • الموضوع:
      2024
    • Collection:
      LCC:Electrical engineering. Electronics. Nuclear engineering
      LCC:Transportation engineering
    • نبذة مختصرة :
      This study presents a thermoset moulding compound designed for electrical machines with high power densities. The compound reduces residual stresses induced by the difference in thermal expansion during use and by shrinkage in the compound during the manufacturing process. To reduce the internal stresses in the compound, in the electrical sheet lamination and at their interface, first the moulding’s coefficient of thermal expansion (CTE) must match that of the lamination because the CTE of the electrical sheets cannot be altered. Second, the shrinkage of the compound needs to be minimized because the moulding compound is injected around a prefabricated electrical sheet lamination. This provides greater freedom in the design of an electric motor or generator, especially if the thermoset needs to be directly bonded to the electrical sheet. The basic suitability of the material for the injection moulding process was iteratively optimised and confirmed by spiral flow tests. Due to the reduction of the residual stresses, the compound enables efficient cooling solutions for electrical machines with high power densities. This innovative compound can have a significant impact on electric propulsion systems across industries that use laminated electrical sheets.
    • File Description:
      electronic resource
    • ISSN:
      2032-6653
    • Relation:
      https://www.mdpi.com/2032-6653/15/7/319; https://doaj.org/toc/2032-6653
    • الرقم المعرف:
      10.3390/wevj15070319
    • الرقم المعرف:
      edsdoj.1d8e05e6d7844fa3b6b791daa327348c