نبذة مختصرة : With the increased interest in silicon photonics, integration and packaging technologies are essential to transforming photonic integrated circuits (PICs) into functional photonic systems. We describe in detail the process to obtain a fully packaged miniature photonic temperature sensor starting from bare PIC dies having Bragg grating sensors in a silicon waveguide. It is also shown that PICs fabricated via multi-project wafer services can show some variability, e.g., in the effective index, which has significant impact on the device functionality (Bragg wavelength) and optical interface (red-shifted grating coupler spectra at default coupling angles). To obtain a final sensor device that is as small as possible the PIC is interfaced from the back side using a 300 μm ball lens. Furthermore, this ensures that the top surface remains clear of any interfacing fibers. Based on this optical interfacing concept, we developed a solution for integrating a 1 mm × 1 mm sensor PIC with a single-mode fiber and packaging it in a 1.5 mm inner-diameter metal protective tube. The accurate position of the ball lens is ensured using a laser-fabricated fused silica precision holder. It is shown that the additional insertion loss caused by the ball lens interface is very limited. A packaged sensor was achieved by sequentially mounting the holder on a ceramic ferrule and then the PIC on the holder and finally gluing a protective metal tube surrounding the assembly, taking care that the PIC surface is flush with the end face of the tube. We demonstrated this concept by realizing a packaged phase-shifted silicon Bragg grating temperature sensor operating around 1550 nm, which could be read out in reflection using a commercial interrogator. A temperature sensitivity of 73 pm∕°C was found, and we demonstrated sensor functionality up to 180°C.
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