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Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony

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  • معلومة اضافية
    • بيانات النشر:
      Springer Science and Business Media LLC
    • الموضوع:
      2020
    • Collection:
      Imperial College London: Spiral
    • نبذة مختصرة :
      Antimony is attracting interest as an addition to Pb-free solders to improve thermal cycling performance in harsher conditions. Here, we investigate microstructure evolution and failure in harsh accelerated thermal cycling (ATC) of a Sn-3.8Ag-0.9Cu solder with 5.5 wt.% antimony as the major addition in two ball grid array (BGA) packages. SbSn particles are shown to precipitate on both Cu6Sn5 and as cuboids in β-Sn, with reproducible orientation relationships and a good lattice match. Similar to Sn-Ag-Cu solders, the microstructure and damage evolution were generally localised in the β-Sn near the component side where localised β-Sn misorientations and subgrains, accelerated SbSn and Ag3Sn particle coarsening, and β-Sn recrystallisation occurred. Cracks grew along the network of recrystallised grain boundaries to failure. The improved ATC performance is mostly attributed to SbSn solid-state precipitation within β-Sn dendrites, which supplements the Ag3Sn that formed in a eutectic reaction between β-Sn dendrites, providing populations of strengthening particles in both the dendritic and eutectic β-Sn.
    • ISSN:
      0361-5235
    • Relation:
      Journal of Electronic Materials; http://hdl.handle.net/10044/1/84154
    • الرقم المعرف:
      10.1007/s11664-020-08507-x
    • Rights:
      © 2020 The Author(s). This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons licence, and indicate if changes were made. The images or other third party material in this article are included in the article's Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article's Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/. ; http://creativecommons.org/licenses/by/4.0/
    • الرقم المعرف:
      edsbas.DD5AC08B