Item request has been placed! ×
Item request cannot be made. ×
loading  Processing Request

A Universal Pick-and-Place Assembly for Nanowires

Item request has been placed! ×
Item request cannot be made. ×
loading   Processing Request
  • معلومة اضافية
    • Contributors:
      Department of Electronics and Nanoengineering; Harri Lipsanen Group; University of Oxford; Beihang University; University of Pennsylvania; Aalto-yliopisto; Aalto University
    • بيانات النشر:
      WILEY-VCH VERLAG
    • الموضوع:
      2022
    • Collection:
      Aalto University Publication Archive (Aaltodoc) / Aalto-yliopiston julkaisuarkistoa
    • نبذة مختصرة :
      Funding Information: The authors thank Nathan Youngblood, Benjamin F. Porter, Jia Hao Eugene Soh, and A.Ne for their valuable inputs during discussions. V.K. acknowledges the support of Aalto University Doctoral School, Walter Ahlström Foundation, Elektroniikkainsinöörien Säätiö, Sähköinsinööriliiton Säätiö, Nokia Foundation, Finnish Foundation for Technology Promotion (Tekniikan Edistämissäätiö), Waldemar von Frenckell's foundation and Kansallis‐Osake‐Pankki fund, and the EU H2020‐MSCA‐RISE‐872049 (IPN‐Bio). V.K. and H.L. acknowledge financial support from Academy of Finland Flagship Programme (320167, PREIN) and the technical support by Aalto University at Micronova Nanofabrication Centre. R.A. and G.M. were supported by the ONR‐MURI, grant #N00014‐17‐1‐2661. UEA was supported by The Scientific and Technological Research Council of Turkey (TÜBİTAK) and the Department of Materials, University of Oxford. H.B. acknowledges long‐term support from EPSRC (grants EP/J00541X/2, EP/M015173/1, EP/T023899/1, EP/J018694/1, and EP/R001677/1). Publisher Copyright: © 2022 The Authors. Small published by Wiley-VCH GmbH. ; With the introduction of techniques to grow highly functional nanowires of exotic materials and demonstrations of their potential in new applications, techniques for depositing nanowires on functional platforms have been an area of active interest. However, difficulties in handling individual nanowires with high accuracy and reliability have so far been a limiting factor in large-scale integration of high-quality nanowires. Here, a technique is demonstrated to transfer single nanowires reliably on virtually any platform, under ambient conditions. Functional nanowires of InP, AlGaAs, and GeTe on various patterned structures such as electrodes, nanophotonic devices, and even ultrathin transmission electron microscopy (TEM) membranes are transferred. It is shown that the versatility of this technique further enables to perform on-chip nano-optomechanical measurements of an InP nanowire for the first time via ...
    • File Description:
      application/pdf
    • ISSN:
      1613-6810
      1613-6829
    • Relation:
      Small; Volume 18, issue 38; Ali, U E, Yang, H, Khayrudinov, V, Modi, G, Cheng, Z, Agarwal, R, Lipsanen, H & Bhaskaran, H 2022, ' A Universal Pick-and-Place Assembly for Nanowires ', Small, vol. 18, no. 38, 2201968 . https://doi.org/10.1002/smll.202201968; PURE UUID: 4ed1c587-c25f-41b9-9113-a74eed1aefbe; PURE ITEMURL: https://research.aalto.fi/en/publications/4ed1c587-c25f-41b9-9113-a74eed1aefbe; PURE LINK: http://www.scopus.com/inward/record.url?scp=85135695240&partnerID=8YFLogxK; PURE FILEURL: https://research.aalto.fi/files/89118535/A_Universal_Pick_and_Place_Assembly_for_Nanowires.pdf; https://aaltodoc.aalto.fi/handle/123456789/117208; URN:NBN:fi:aalto-202210195996
    • الرقم المعرف:
      10.1002/smll.202201968
    • Rights:
      openAccess
    • الرقم المعرف:
      edsbas.D7471DDB