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Diffusion barriers for Cu metallisation in Si integrated circuits : deposition and related thin film properties

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  • المؤلفون: Bystrova, Svetlana
  • نوع التسجيلة:
    doctoral or postdoctoral thesis
  • اللغة:
    unknown
  • معلومة اضافية
    • بيانات النشر:
      University of Twente
    • الموضوع:
      2004
    • Collection:
      University of Twente Publications
    • نبذة مختصرة :
      This thesis presents results of a study focused on the growth processes of tungsten nitride silicide films by CVD; tungsten nitride and tungsten carbidonitride films by ALD
    • File Description:
      application/pdf
    • Relation:
      http://doc.utwente.nl/48234/1/thesis_Bystrova.pdf; http://purl.utwente.nl/publications/48234
    • الرقم المعرف:
      edsbas.D6F2103B