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Usage Of Solders With Higher Melting Point For Hybrid Integrated Circuits

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اقرأ أكثر حفظ في قائمتي
  • المؤلفون: Janda, Ondřej
  • المصدر:
    Proceedings of the 24th Conference STUDENT EEICT 2018. s. 79-81. ISBN 978-80-214-5614-3
  • الموضوع:
    Brazing; thick film; leaching
  • نوع التسجيلة:
    conference object
  • اللغة:
    English
  • معلومة اضافية
    • بيانات النشر:
      Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
    • الموضوع:
      2018
    • Collection:
      Brno University of Technology (VUT): Digital Library / Vysoké učení technické v Brně: Digitální knihovně
    • نبذة مختصرة :
      This article deals with the advantages of brazing that uses an experimental tool for heat conduction, which can be used in thick film technology. In present days brazing on thick film is used in a few applications in microelectronic industry. At higher soldering temperatures there is also an increase in demands leading to creation of high quality joints. The joints made by brazing are mainly used for special applications for power electronics, heating elements and temperature or other sensors.
    • File Description:
      text; 79-81; application/pdf
    • ISBN:
      978-80-214-5614-3
      80-214-5614-0
    • Relation:
      Proceedings of the 24th Conference STUDENT EEICT 2018; http://www.feec.vutbr.cz/EEICT/; http://hdl.handle.net/11012/138174
    • Rights:
      © Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií ; openAccess
    • الرقم المعرف:
      edsbas.C50BD5C0