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Defect formation and mitigation in Cu/Cu joints formed through transient liquid phase bonding with Cu-Sn nanocomposite interlayer

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اقرأ أكثر حفظ في قائمتي
  • معلومة اضافية
    • Contributors:
      Loughborough University; China Scholarship Council; Engineering and Physical Sciences Research Council
    • بيانات النشر:
      Elsevier BV
    • الموضوع:
      2022
    • Collection:
      ScienceDirect (Elsevier - Open Access Articles via Crossref)
    • الرقم المعرف:
      10.1016/j.microrel.2022.114681
    • Rights:
      https://www.elsevier.com/tdm/userlicense/1.0/ ; http://creativecommons.org/licenses/by/4.0/
    • الرقم المعرف:
      edsbas.5A974899