Metalorganic vapour phase epitaxy of III-As semiconductors on silicon substrate and formation of ohmic contacts for photonic and radiofrequency applications on silicon ; Epitaxie en phase vapeur aux organométalliques de semiconducteurs III-As sur substrat silicium et formation de contacts ohmiques pour les applications photoniques et RF sur silicium

With the emergence of Internet of Things (IoT), diversification of communication means and rise of processors’ computational power, the requirements in data exchange never stopped rising. These technologies need to combine on integrated circuits, optical and RF purposes fabricated from III-V compounds with silicon logical functions. However, as preliminary for the achievement of such devices, III-V semiconductors with good crystal quality have to be obtained on silicon substrates and formation of n & p type contacts with low resistivity is required. The purpose of this thesis is to integrate GaAs on silicon because this semiconductor is frequently used for the fabrication of emitters and receptors for wireless communication as well as in LEDs and lasers’ conception. With this is mind, this PhD work focuses on the growth of GaAs on 300 mm silicon substrates by metalorganic chemical vapour deposition and the formation of n & p type contacts with low contact resistivity on this GaAs. Firstly, efforts will put on the removal of the crystalline defects being the most prohibitive for the use of such materials: antiphase boundaries and threading dislocations. Then, structural (X-ray diffraction, FIB STEM), morphological (AFM), electrical (Hall Effect) and optical (photoluminescence) characterizations will highlight the quality of the epitaxial films. Finally, the evolution of GaAs properties (optical and transport) and the formation of n & p-type contacts with low resistivity will be discussed. ; Avec l’avènement de l’internet des objets, la diversification des moyens de communication et l’augmentation de la puissance de calcul des processeurs, les besoins en termes d’échange de données n’ont cessé d’augmenter. Ces technologies nécessitent de combiner notamment sur un circuit intégré des fonctions optiques et RF réalisées à partir de matériaux III-V avec des fonctions logiques en silicium. Cependant en pré requis à la réalisation de ces dispositifs, il faut obtenir des couches de III-V sur des substrats de ...